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Dots and Boxes is one of college students' national computer game competition chesses in China. The shortcomings of traditional machine-machine game of Dots and Boxes are presented. In order to overcome this disadvantage, the dots and boxes battle platform in computer game is introduced. The construction methods of the Dots and Boxes battle platform in computer game, including function design, model design, and game protocol design, etc. are studied. Some techniques to solve some key problems are given. It has an important referential value to realize the battle platform of a certain sort of chess.

As an indispensible part of electronic equipment, the reliability of the whole system is affected by the degradation performance of power MOSFET tube. Based on geometry, material properties and boundary conditions, the repeated testing can be reduced, and the period of failure analysis can be shortened. This article is based on the finite element model of power MOSFET TO-263, electric thermal — mechanical coupling analysis is introduced. The steady and transient thermal analysis is given, and then the inelastic strain range of thermal stress is calculated Finally on the basis of these, simulation can be realized, thermal fatigue life of power MOSFET tube is predicted through the Coffin — Manson's law.

Considering the influence of the cost, reliability and environment issues, the lead-free material of solder connection is paid more and more attention in integrated circuit packaging field. As the substitute of traditional solder, conductive adhesive has its own advantages. In this paper, a ball grid array (BGA) is chosen to illustrate the fatigue model for the methods of strain-based and energy-based life prediction. The strain analysis theory and the finite element analysis (FEM) simulation of fatigue life prediction are introduced in this paper. The conductive adhesive's failure mechanism of theoretical analysis is described. By means of finite element analysis, thermal stress simulation curve of conductive adhesive is analysed. The curve (s-n curve) of conductive adhesive fatigue life and load amplitude as well as fatigue sensitivity coefficient is given. And failure of life under different stress is predicted. Finally, the outlook of conductive adhesive connection reliability is also expounded.

The performance of intelligent power module (IPM) will severely degrade with high junction temperature. Thus, it's important to get the thermal characterization of IPM package. In this paper, a method integrating electrical test method (ETM) and finite elements analysis (FEA) is put forward to analyze the thermal performance of a Transfer Molding IPM package. Electrical test method was used for thermal resistance test of the package under single freewheel diode heating in the one sixth module. The test results were then used for the calibration of finite elements model and boundary conditions. After validating the effectiveness of the finite element model and boundary conditions, thermal performance of the IPM package under multi-chip heating is obtained through numerical simulation. The method has certain practical meaning in the fast evaluation of power electronics' thermal performance.

Low energy oscillations (LEOs), lower than the band gap of Ga(Mn)As, were observed well in the photo-modulation reflectance and reflectance spectra of GaMnAs grown by low temperature molecular-beam epitaxy. By simulating the oscillations of the reflectance spectra, These LEOs were contributed to the variable refractive indexes induced by the high hole density in GaMnAs.

A simple route for preparing high-temperature phase nanppartiles is presented. Pulsed laser ablation (PLA) in the liquid phase was successfully employed to synthesize high-temperature phase nanoparticles, such as rutile TiO 2 , wustite FeO. The crystalline phase, particle morphology and laser ablation mechanism for the colloidal nanoparticles were investigated using XRD, TEM. The laser ablation and the nanoparticle forming process were discussed.

This work presents red organic light-emitting diodes based on tris-(8-hydroxy-quinolinato) aluminum (Alq 3 ) co-doped with a new pentacene derivative, 6,13-di-(3,5-diphenyl)phenylpentacene(PDT), and 5,6,11,12-tetraphenylnaphthacene(rubrene). The experimental results suggest that rubrene is doped as an assist dopant to enhance energy transfer from Alq 3 to PDT in Alq 3 :PDT:rubrene, which results in good color purity of red emission. For the device with the emitting layer of [Alq 3 :3mol%PDT:1 mol%rubrene(60nm)], a stable red emission (chromaticity coordinate: x=0.61, y=0.37) is obtained within the driving current density range of 12 to 120mA/cm2. The luminance is 4400cd/m2 at 21V. And a maximum luminance efficiency of 2.4cd/A is measured at current density of 120 mA/cm2.