1. Improvement in high-temperature dielectric properties of epoxy resin by abundant addition of micro-silica
- Author
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Mitsukazu Ochi, Miyuki Harada, Mayumi Hyuga, Yoshimichi Ohki, Toshikatsu Tanaka, Takahiro Imai, and Naoki Tagami
- Subjects
Permittivity ,chemistry.chemical_classification ,Materials science ,Silica fume ,Epoxy ,Dielectric ,Polymer ,Conductivity ,chemistry ,visual_art ,visual_art.visual_art_medium ,Dielectric loss ,Composite material ,Glass transition - Abstract
Effects of addition of micro-sized silica fillers and/or nano-sized clay fillers into epoxy resin on its dielectric properties were examined. The glass transition intermediate temperature (Jg) was found to show a decrease by the addition of a small amount of nanofillers, while it is increased by the addition of abundant microfillers with and without co-addition of a small amount of nanofillers. At temperatures above T g , the samples with abundant microfillers were added have low conductivity, low dielectric constant, and low dielectric loss factor regardless of the co-addition of nanofillers.
- Published
- 2009
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