1. Analysis of 60 GHz flip-chipped package using EM tool-based time-domain reflectometry
- Author
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M.I. Kazim, M.H.A.J. Herben, and Electromagnetics
- Subjects
Interconnection ,Engineering ,business.industry ,System of measurement ,Amplifier ,Electrical engineering ,Microstrip antenna ,SDG 3 - Good Health and Well-being ,Transmission (telecommunications) ,Hardware_INTEGRATEDCIRCUITS ,Electronic engineering ,Time domain ,Antenna (radio) ,Reflectometry ,business - Abstract
A systematic approach based on ‘package-peeling’ together with time-domain reflectometry (TDR) for package characterization using an EM-tool is presented. The said methodology is applied to investigate and address the possible causes of transmission losses for a measured 60 GHz flip-chipped package, embedding a power amplifier (PA) and a balanced-fed-aperture-coupled-patch (BFACP) antenna with an anisotropic conductive adhesive (ACA) flip-chip interconnection scheme. The proposed technique caters for TDR measurement system limitations and aids in investigation and improving the performance of the millimeter-wave flip-chipped packages.
- Published
- 2012
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