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Electronic package edge metal profiles have an effect on package characteristics on an order increasingly close to the tolerances expected for the package electrical performance. Several two-dimensional (2-D) tools are available that can be used to evaluate predesign and layout issues with nonrectangular edge profiles. However, tools that extract models from actual designs using the most up-to-date computer-aided design/computer-aided engineering (CAD/CAE) design and modeling flows do not yet take into account these real-world metal geometries. Variations in impedance and crosstalk associated with real profiles versus rectangular idealizations are identified for some typical cases and a computational procedure is discussed which may efficiently address this problem. [ABSTRACT FROM AUTHOR]

A robust, efficient, and accurate inductance extraction and simulation tool, INDUCTWISE, is developed and described in this paper. This work advances the state-of-the-art inductance extraction and simulation techniques, and has several major contributions. First, albeit the great benefits of efficiency, the recently proposed inductance matrix sparsification algorithm, the K-method (Ji et al. 2001), has a flaw in the stability proof for general geometry. We provide a theoretical analysis as well as a provable stable algorithm for it. Second, a robust window-selection algorithm is presented for general geometry. Third, integrated with the nodal analysis formulation, INDUCTWISE achieves exceptional performance without frequency-dependent complex operations and directly gives time-domain responses. Experimental results show that INDUCTWISE extractor and simulator have dramatic speedup compared to FastHenry and SPICE3, respectively. It has been well tested and released on the web for public usage (Available: http://vlsi.ece.wisc.edu/Inductwise.htm). [ABSTRACT FROM AUTHOR]