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13. Detection of Polarization and Topological Charge Based on Multidimensional Field of Metasurface.

Author

Luan, Jing, Yang, Sikang, Liu, Deming, and Zhang, Minming

Abstract

Integrating multiple functionalities into one single device is of great importance for ever-growing demand of photonic device. Optical vortex beam contains orbital angular momentum (OAM) and spin angular momentum (SAM) associated with phase and polarization singularities respectively, which has contributed to various application including optical manipulation, optical trapping and high-speed optical communication. Traditional methods to detect its phase and polarization mostly focus on the functionality of single dimensional optical field. However, quite different from the previous reports, we here propose a novel approach to measure the phase and polarization state based on the full use of near and far-field light functionalities in one single metadevice, which supports spin-controlled surface plasmon polaritons (SPPs) and topological charge-dependent focus spot position. On the one hand, this design makes the most of multidimensional field optical scattering characteristics to rich the functions of metadevice. On the other hand, it provides a novel concept to recognize various angular momentum information of vortex beam. We believe that such design will have great potential for the integration of different sub-wavelength optical components. [ABSTRACT FROM AUTHOR]

Published
2020
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22. Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics?

Author

Xavier Baraton, Andrew A. O. Tay, Luan Jing-en, and Hu Guojun

Subjects
Strain energy release rate, Materials science, Soldering, von Mises yield criterion, Fracture mechanics, Integrated circuit packaging, Composite material, Temperature coefficient, Finite element method, Stress intensity factor
Abstract

After encapsulation, thermo-mechanical deformation builds up within the electronic packages due to temperature coefficient of expansion mismatch between the respective materials within the package as it cools to room temperature. The maximum Von Mises stress or principle stress criterion based on stress analysis and maximum energy release rate criterion based on fracture mechanics are two of the most popular criteria for failure prediction. However, it is well known that the stress calculation based on finite element analysis (FEA) is mesh dependent and stress fields around bonded corners showed singular behaviors. The objective of this work is to investigate a few interface delamination cases in IC packaging using stress analysis and fracture mechanics respectively. The approach is to quantify the stress, energy release rate and corresponding phase angle at room temperature and lead-free solder reflow temperature. A suitable criterion for the estimation of interface delamination will be proposed based on FEA and the results based on simulation will be compared with experiment study.

Published
2009

23. Characterization of silicon die strength with application to die crack analysis

Author

Hu Guojun, Xavier Baraton, and Luan Jing-en

Subjects
Engineering drawing, Materials science, Ball grid array, Surface roughness, Test method, Temperature cycling, Surface finish, Composite material, Die (integrated circuit), Finite element method, Grinding
Abstract

After encapsulation, thermo-mechanical deformation builds up within the electronic packages due to temperature coefficient of expansion mismatch between the respective materials within the package as it cools to room temperature. As the trends in semiconductor packages continue toward a decrease in overall package size and an increase in functionality and performance requirements, they bring challenges of processing, handling, and understanding smaller components and, in particular, thinner dies. One of the reliability problems, die crack, becomes more serious due to the larger die area compared with package size, thinner thickness and thermal mismatch between the respective materials within the package. Die strength can be adversely affected during various manufacturing processes, such as grinding and chipping. A realistic understanding of the significance of processing on die strength is gained through the study of the actual, processed component. This work try to find the simple test method for determination of die strength to improve the scatter and try to differentiate the factors that affect the variability of die strength, in order to find out the causes of the weakness of the die strength. The surface conditions (roughness) of the specimens are determined by atomic force microscopy (AFM) and correlated to failure strength. A practical example is presented here that die cracking analysis has been done for a chip array thin core BGA (CTBGA) during thermal cycling. The die stress is calculated based on the finite element analysis (FEA) of CTBGA and the FEA-predicted die stress is used to predict the die failure rate compared with the experiment results.

Published
2008

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