236 results on '"Lin, C H."'
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2. Single-Image HDR Reconstruction Based on Two-Stage GAN Structure
3. E-Core Implementation in Intel 4 with PowerVia (Backside Power) Technology
4. Spintronic terahertz emitters exploiting uniaxial magnetic anisotropy for field-free emission and polarization control
5. Longitudinally Polarized Terahertz Radiation from Spintronic Emitters
6. Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages
7. Sub-ns Access Sub-mW/GHz 32 Kb SRAM with 0.45 V Cross-Point-5T Cell and Built-in Y_ Line
8. Integrated Control of Renewable Energy and Fault Restoration for Distribution Systems
9. How stiffness affects on the dynamics of a double-link aerodynamic pendulum
10. Coordination of transformer on-load tap changer and PV smart inverters for voltage control of distribution feeders
11. Interfacial reactions between Sn and Au-xCu alloys
12. Bottom-up methodology for predictive simulations of self-heating in aggressively scaled process technologies
13. Thermally stable and flexible paper photosensors based on 2D BN nanosheets
14. A 7nm CMOS technology platform for mobile and high performance compute application
15. Transformer management system for energy control of customer demand response and PV systems
16. Distribution network reconfiguration for load balancing with a colored Petri net algorithm
17. A colored Petri net models with intelligent function for power system restoration of semiconductor industry
18. A fuzzy color Petri Net for repair scheduling and dispatching of large-scale contingencies in distribution system
19. Mitigation of voltage variation by REMS for distribution feeders
20. Thermal reliability analysis of through-aluminium-nitride-via substrate for high-power LED applications
21. High performance In0.53Ga0.47As FinFETs fabricated on 300 mm Si substrate
22. Ti and NiPt/Ti liner silicide contacts for advanced technologies
23. Study of selective laser melting process for cubic models with various porosities
24. f2MOVE: fMRI-compatible haptic object manipulation system for closed-loop motor control studies
25. Advanced device performance impact by wafer level 3D stacked architecture
26. Off-state self-heating, micro-hot-spots, and stress-induced device considerations in scaled technologies
27. In0.53Ga0.47As MOSFETs with high channel mobility and gate stack quality fabricated on 300 mm Si substrate
28. A novel ALD SiBCN low-k spacer for parasitic capacitance reduction in FinFETs
29. Coordination control of PV inverters for load transfer operation of distribution feeders with high penetration of PV installation
30. Study of sub-5 nm RRAM, tunneling selector and selector less device
31. Process development of replacement metal gate Tungsten chemical mechanical polishing on 14nm technology node and beyond
32. Mechanical design and analysis of direct plated copper film on AlN substrates for thermal reliability in high power module applications
33. High performance 14nm SOI FinFET CMOS technology with 0.0174µm2 embedded DRAM and 15 levels of Cu metallization
34. Design of special protection system for an offshore island with high PV penetration.
35. The Amorphous-Si CMP process improvement for L14 nm FinFET technology node
36. High-k metal gate poly opening polish at 28nm technology polish rate and selective study
37. NTUH-II robot arm with dynamic torque gain adjustment method for frozen shoulder rehabilitation
38. Real-time dangling objects sensing: A preliminary design of mobile headset ancillary device for visual impaired
39. Modelling and simulation for INER AC microgrid control
40. Design of an intelligent transformer management system
41. 300mm size ultra-thin glass interposer technology and high-Q embedded helical inductor (EHI) for mobile application
42. Speckle contrast reduction by linear and nonlinear photonic devices
43. Wafer level packaging for chambers of two different pressures
44. Effects of BEOL copper CMP process on TDDB for direct polishing ultra-low k dielectric cu interconnects at 28nm technology node and beyond
45. Advanced distribution automation system for control of PV inverters to enhance PV penetration
46. Modeling of the nipip HIT structure with the hole thermionic emission mechanism
47. 22nm High-performance SOI technology featuring dual-embedded stressors, Epi-Plate High-K deep-trench embedded DRAM and self-aligned Via 15LM BEOL
48. Optimization of photovoltaic penetration with DSTATCOM in distribution systems
49. Rule-based expert system for service restoration in distribution automation systems
50. Channel doping impact on FinFETs for 22nm and beyond
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