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1. Scaling of Memory Performance and Capacity with CXL Memory Expander

3. Multiple Workfunction High Performance FinFETs for Ultra-low Voltage Operation

4. Quantitative model of CMOS inverter chain ring oscillator's effective capacitance and its improvements in 14nm FinFET technology

5. Impact of aggressive fin width scaling on FinFET device characteristics

7. Electrical Resistivity and Magnetic Performance of Ceramics-Bonded Nd-Fe-B-Type Magnet Consolidated Using Dielectric Oxide Binder.

8. Ultralow-resistivity CMOS contact scheme with pre-contact amorphization plus Ti (germano-)silicidation

9. 1.5×10−9 Ωcm2 Contact resistivity on highly doped Si:P using Ge pre-amorphization and Ti silicidation

10. Coercivity and Phase Evolution in Mechanically Milled (FeCo)2B-Type Hard Magnetic Alloy.

11. 14-nm FinFET Technology for Analog and RF Applications.

12. Improvement of Magnetic Performance of Nd–Fe–B-Type Die-Upset Magnet by RF3-Doping.

16. Effect of Rare-Earth Dopant on Coercivity of Hot-Pressed Nd–Fe–B Magnet Doped With RF3.

18. Coercivity of Nd-Fe-B-Type Fine Particles Prepared by Mechanical Milling of HDDR Material.

21. A 0.15 μm DRAM technology node for 4 Gb DRAM

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