165 results on '"Lang K"'
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2. Development of innovative substrate and embedding technologies for high frequency applications
3. Manufacturing of high frequency substrates as software programmable metasurfaces on PCBs with integrated controller nodes
4. Reliability of Substrate Embedded Rectifiers for High Voltage Applications
5. Panel Level Packaging - From Idea to Industrialization -
6. Panel Level Packaging for Component Integration of an Energy Harvesting System
7. High Frequency Substrate Technologies for the Realisation of Software Programmable Metasurfaces on PCB Hardware Platforms with Integrated Controller Nodes
8. Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection
9. Embedding Technologies for the Manufacturing of Advanced Miniaturised Modules toward the Realisation of Compact and Environmentally Friendly Electronic Devices
10. Where is the Sweet Spot for Panel Level Packaging?
11. Panel Level Packaging - A View Along the Process Chain
12. Fan-out wafer level packaging for 5G and mm-Wave applications
13. Determination of relevant material behavior for use in stretchable electronics
14. Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact
15. Development of a Multi-project Fan-Out Wafer Level Packaging Platform
16. Embedding of wearable electronics into smart sensor insole
17. Efficiency and loss mapping of AC motors using advanced testing tools
18. Glass based interposers for RF applications up to 100GHz
19. Foldable Fan-Out Wafer Level Packaging
20. Gold TSVs (Through Silicon Vias) for High-Frequency III-V Semiconductor Applications
21. Ageing phenomena in isotropic conductive adhesive material investigated by experimental and simulation techniques
22. Opportunities of Fan-out Wafer Level Packaging (FOWLP) for RF applications
23. Plasma enhanced atomic layer deposition by means of an Anode Layer Ion Source for electronics packaging applications
24. HIPIMS in full face erosion circular cathode for semiconductor applications
25. Material and process trends for moving from FOWLP to FOPLP
26. High frequency impedance of Li-ion batteries
27. From fan-out wafer to fan-out panel level packaging
28. Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices
29. Large area compression molding for Fan-out Panel Level Packing
30. Raw data based model and high dynamic control concept for traction drives powered by synchronous reluctance machines
31. Challenges and opportunities for Fan-out Panel Level Packing (FOPLP)
32. Automotive high voltage grid simulation modelling and simulation high voltage car grids from system prospective
33. A “microSD”sized RF transceiver manufactured as an embedded system-in-package
34. On double sided cooling
35. Investigating wire bonding pull testing and its calculation basics
36. Use of periodic stalks to model L band returns from corn
37. SIMEIT-project: High precision inertial sensor integration on a modular 3D-Interposer platform
38. 24"×18" Fan-out panel level packing
39. Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
40. Development of process and design criteria for stress management in through silicon vias
41. Analysis of mechanical properties of thermal cycled Cu Plated-Through Holes (PTH)
42. 3D integration of standard integrated circuits
43. From fan-out wafer to fan-out panel level packaging.
44. Influence of humidity on reliability of plastic packages.
45. Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
46. Moisture induced swelling in epoxy moulding compounds
47. From wafer level to panel level mold embedding
48. Moisture transport and swelling stresses at moulding-compound substrate interfaces investigated by molecular modeling and finite element simulations
49. Mechanically relevant chemical shrinkage of epoxy molding compounds
50. Through mold via technology for multi-sensor stacking
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