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A highly robust gap-fill process technology of spin-on glass (SOG) was developed for the interlayer dielectric (ILD) in sub-30nm devices. We revealed that the filling behavior of SOG within gaps during spin-coating is mainly dependent on the capillary effect. The highly wettable surface treatment prior to SOG coating was found to enhance the gap-fill performance remarkably. This technique plays a key role in maximizing capillary effect by raising surface wettability. The filling capability was also improved by optimization of baking temperature to minimize the viscosity of SOG. It was finally found that the defects of contact bridges due to poor filling of SOG were reduced to be almost free by those unique process refinements.

Incorporation of metal nanoparticles in Polyaniline composites could effectively improve its optical, thermal and electrical properties and making it an ideal for the use in semiconductor industry. In this study Ag nanoparticles were uniformly dispersed ultrasonically in the solution of polyaniline emeraldine base (PANIEB) and isopropyl alcohol. PANIEB used in this experiment were doped with polymer of methacrylic acid ester and vinyl verstate. The results about the morphological, optical and electrical properties of Ag-PANIEB with IPA colloid as a function of different concentration of Ag nanoparticles (Such as 25%, 50%, 100% by weight) were presented and discussed.