32 results on '"Huang, Shaowu"'
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2. Techniques for improving system-in-package integration and electrical performance
3. Using Broadband Green's function method to model interconnects of traces and vias
4. Thermal and Electrical Performance of Direct Bond Interconnect Technology for 2.5D and 3D Integrated Circuits
5. Novel de-embedding method with look-up table for characterization of interconnects
6. New broadband equalizer optimization technique for digital system designs
7. Analysis of radiated emissions from PCB using broadband Green's function method
8. Novel characterization technique with short and open standards
9. Improve electrical performance of interconnects using inkjet printing
10. Probe with absorbing materials
11. Modeling of Scattering in Arbitrary-Shape Waveguide Using Broadband Green's Function With Higher Order Low Wavenumber Extractions.
12. Novel de-embedding method with Look-Up Table for characterization of interconnects
13. New broadband equalizer optimization technique for digital system designs
14. Broadband Green's function and applications to fast electromagnetic modeling of high speed interconnects
15. Suppression of Cavity Resonant Edge Effects and PDN impedance using absorbing material
16. Rigorous one-port measurement method for the characterization of on-chip pad response
17. Integrated power supply packaging technique with reduced parasitic inductance for on-die voltage regulator design and application
18. Technique to improve the accuracy of mixed-mode S-parameters derived from single-ended results and application to shorter test coupon design
19. Fast Broadband Modeling of Traces Connecting Vias in Printed Circuit Boards Using Broadband Green’s Function Method.
20. Absorbing Termination for High-Frequency Measurements of Interconnects.
21. Improvements of System-in-Package Integration and Electrical Performance Using BVA Wire Bonding.
22. Fast Electromagnetic Analysis of Emissions From Printed Circuit Board Using Broadband Green's Function Method.
23. Suppression of Couplings in High-Speed Interconnects Using Absorbing Materials.
24. Stub Effect Mitigations Using Absorbing Materials.
25. Copolarized and Cross-Polarized Backscattering From Random Rough Soil Surfaces From L-Band to Ku-Band Using Numerical Solutions of Maxwell's Equations With Near-Field Precondition.
26. Subwavelength imaging of plasmon superlens with 3-dimensional small surface roughness
27. Soil moisture retrieval over low-vegetation surfaces using time-series radar observations and a lookup table representation of forward scattering
28. Bistatic scattering, backscattering and emissivities of randomly rough soil surfaces at L band based on numerical solutions of Maxwell equations of 3 Dimensional simulations
29. Active and Passive Vegetated Surface Models With Rough Surface Boundary Conditions From NMM3D.
30. Electromagnetic Computation in Scattering of Electromagnetic Waves by Random Rough Surface and Dense Media in Microwave Remote Sensing of Land Surfaces.
31. Electromagnetic Scattering of Randomly Rough Soil Surfaces Based on Numerical Solutions of Maxwell Equations in Three-Dimensional Simulations Using a Hybrid UV/PBTG/SMCG Method.
32. Broadband Green's function and applications to fast electromagnetic modeling of high speed interconnects.
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