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In this letter, novel heterostructure p-i-n GaN avalanche photodiodes (APDs) with p-type In0.05Ga0.95N layer are proposed and analyzed through Silvaco Atlas simulations. The introduction of the In0.05Ga0.95N layer generates a negative polarization charge at the p-In0.05Ga0.95N/i-GaN heterojunction interface via the piezoelectric polarization effect. Three times higher hole concentration in the p-In0.05Ga0.95N layer is obtained due to the smaller activation energy of the Mg dopant. Induced polarization charge and increased hole concentration work together to reduce the voltage drop in the p-In0.05Ga0.95N layer and enhance the electric field intensity in the i-GaN layer. The calculated results show that the heterostructure APD demonstrates a reduced operating voltage of more than 26 V and an improved multiplication gain by an order of magnitude in comparison to the conventional one.

In this letter, novel heterostructure p-i-n GaN avalanche photodiodes (APDs) with p-type In0.05Ga0.95N layer are proposed and analyzed through Silvaco Atlas simulations. The introduction of the In0.05Ga0.95N layer generates a negative polarization charge at the p-In0.05Ga0.95N/i-GaN heterojunction interface via the piezoelectric polarization effect. Three times higher hole concentration in the p-In0.05Ga0.95N layer is obtained due to the smaller activation energy of the Mg dopant. Induced polarization charge and increased hole concentration work together to reduce the voltage drop in the p-In0.05Ga0.95N layer and enhance the electric field intensity in the i-GaN layer. The calculated results show that the heterostructure APD demonstrates a reduced operating voltage of more than 26 V and an improved multiplication gain by an order of magnitude in comparison to the conventional one. [ABSTRACT FROM AUTHOR]

The performance characteristics of green light-emitting diodes (LEDs) grown by metal-organic chemical-vapor deposition were investigated to study the dependence of the device performance on the materials and the growth conditions of p-type layer grown after the InGaN multiple-quantum-well active region. The electrical and structural qualities of Mg-doped p-In0.04Ga0.96N and p-GaN layers grown under different growth conditions were studied to optimize the growth conditions of p-type hole injection layers of green LEDs. A free-hole concentration of p=1.6times1018 cm-3 of with a resistivity of 0.33Omegamiddotcm was achieved for p-GaN:Mg layers grown at 1040degC. Lower hole concentrations and mobilities and rough surfaces were obtained when the growth temperature was decreased to 930degC in H2 ambient. In the case of p-In0.04Ga0.96N grown at 840degC in N2, a significant improvement of the hole concentration was achieved due to the reduced ionization activation energy of Mg acceptors in InGaN. Also we observed that as-grown p-GaN layers grown in N2 ambient showed p-type properties without Mg dopant activation. The electrical and optical properties of In0.25Ga0.75 N/GaN multiple-quantum-well green LEDs with such different p-layers were investigated. The electroluminescence intensity was improved for the LEDs with p-In0.04Ga0.96N layers grown at 840degC as compared to the LEDs with p-GaN layers grown at higher temperatures due to the reduced thermal damage to the active region, high hole injection, and low piezoelectric field induced in the active region. p-InGaN layers are very attractive candidates for the p-layer in green LED structures. The low temperature and N2 ambient used during the growth of InGaN layers are beneficial to protect the InGaN active region containing high-indium composition quantum-well layers in a- ddition to the advantage of providing a higher hole concentration. However, the LEDs with p-In0.04Ga0.96 N layer showed a slightly higher turn on voltage which could originate from the potential barrier for hole transport at the interface of the p-InGaN layer and the last GaN quantum-well barrier. to reduce this problem, we designed and characterized an LED structure having a graded indium composition in the p-In0.04Ga0.96N layer in order to improve hole transport into the active region. Optimized LEDs with p-InGaN layers grown in a N2 ambient showed much brighter electroluminescence due to low damage to the active region during p-InGaN layer growth [ABSTRACT FROM PUBLISHER]

We report our studies on the photo doping effect in YBa/sub 2/Cu/sub 3/O/sub x/ (YBCO) grain-boundary weak links and partially oxygen-depleted (T/sub c,mid/ /spl ap/52 K) thin films, We focus our attention on the erasable process, in which persistent photoconductivity (PPC) introduced by light at low temperatures relaxes back above 260 K. In the tested 2-/spl mu/m-wide step-edge grain-boundary junctions, PPC manifested itself as above 30% increase of the critical current, while the illuminated films exhibited up to 2.5 K enhancement of T/sub c/'s. In the case of films, we also observed upon illumination a continuous decrease (no saturation effect) of both the longitudinal and transversal (Hall) resistivities. In-situ Hall effect band model, PPC at low temperatures results in the increase of both the hole mobility and concentration, while at temperatures above 250 K, the mobility is reduced after prolonged illumination, whereas the carrier concentration is enhanced even more than allow temperatures. We have also demonstrated that the T/sub c/ enhancement due to photodoping is a function of the carrier concentration rather than the mobility, Our experimental results indicate that the physical origin of PPC is same in both YBCO grain-boundary junctions and partially oxygen-depleted films, and can be understood as the coexistence of photoassisted oxygen ordering and photoinduced charge transfer. [ABSTRACT FROM PUBLISHER]

In this study, we used the selective ring-region activation technique to restrain the surface leakage current and to monitor the luminescence characteristics of InGaN-GaN multiple quantum-well blue light-emitting diodes (LEDs). To access the current blocking region after forming a periphery high-resistance ring-region of the Mg-doped GaN layer and to reduce the degree of carrier trapping by the surface recombination centers, we deposited a titanium film onto the Mg-doped GaN epitaxial layer to form a high-resistance current blocking region. To characterize their luminescence performance, we prepared LEDs incorporating titanium films of various widths of the highly resistive current blocking layer. The hole concentration in the Mg-doped GaN epitaxial layer decreased from 3.45times1017 cm-3 to 3.31times1016cm-3 after capping with a 250-nm-thick layer of titanium and annealing at 700 degC under a nitrogen atmosphere for 30 min. Furthermore, the luminescence characteristics could be improved by varying the width of the highly resistive region of the current blocking area; in our best result, the relative electroluminescence intensity was 30% (20 mA) and 50% (100 mA) higher than that of the as-grown blue LEDs [ABSTRACT FROM PUBLISHER]

In an attempt to enhance the reliability of GaN-based light-emitting diodes (LEDs), the selective wet chemical etching of p-GaN surface in the GaN-based LEDs using KOH+NaOH in an ethylene glycol solution was investigated. The leakage currents of the etched LED under forward and reverse bias voltages were much lower, compared to those of a nonetched LED. The etched LED also showed improved light extraction efficiency and the degradation rate of light output power at a high injection current of 300 mA was slower than that for a nonetched LED. These results can be attributed to a decrease in the surface defects, an increase in hole concentration, and the increased surface roughness of the etched p-GaN [ABSTRACT FROM PUBLISHER]

The selective wet etching of a p-GaN layer by using a solution of KOH in ethylene glycol (KE) was studied to enhance the optical and electrical performance of the GaN-based light-emitting diodes (LEDs). The surface of the p-GaN, which was selectively etched in the KE solution, showed hexagonal-shaped etch pits. The light-output power of etched LEDs was improved by 29.4% compared to that of the nonetched LED. This improvement was attributed to the increase in the probability of photons to escape due to the increased surface area of textured surface and the reduction in contact resistance of the ohmic layer resulting from the increased contact area and hole concentration on the textured p-GaN. The reverse leakage current of the LED was also greatly decreased due to the surface passivation and the removal of defective regions from the p-GaN. [ABSTRACT FROM PUBLISHER]

Nitride-bass light-emitting diodes (LEDs) with Mg-doped In[sub0.23]Ga[sub0.77]N capping layers were successfully fabricated. Compared to Mg-doped GaN layers, it was found that we could achieve a much larger hole concentration from Mg-doped In[sub0.23]Ga[sub0.77]N layers. It was also found that we could reduce the 20 mA operation voltage from 3.78 to 3.37 V by introducing a 5-nm-thick In[sub0.23]Ga[sub0.77]N layer on top of the p-GaN layer. Furthermore, it was found that output intensity of LEDs with In[sub0.23]Ga[sub0.77]N capping layer was much larger, particularly at elevated temperatures. [ABSTRACT FROM AUTHOR]