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174 results on '"Hoffmann, T"'

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5. A highly integrated 65-nm SoC process with enhanced power/performance of digital and analog circuits

7. 3D-carrier profiling in FinFETs using scanning spreading resistance microscopy

8. Dopant and carrier profiling for 3D-device architectures

12. On the origin of the mobility reduction in bulk-Si, UTBOX-FDSOI and SiGe devices with ultrathin-EOT dielectrics

15. High-mobility 0.85nm-EOT Si0.45Ge0.55-pFETs: Delivering high performance at scaled VDD

17. Low-frequency noise in strained and relaxed Ge pMOSFETs

18. Dopant and carrier profiling in FinFET-based devices with sub-nanometer resolution

19. High-mobility Si1−xGex-channel PFETs: Layout dependence and enhanced scalability, demonstrating 90% performance boost at narrow widths

20. Ion-implantation-based low-cost Hk/MG process for CMOS low-power application

22. 8Å Tinv gate-first dual channel technology achieving low-Vt high performance CMOS

24. Key sub 1nm EOT CMOS enabler by comprehensive PMOS design

26. Enabling the high-performance InGaAs/Ge CMOS: a common gate stack solution

27. Silicide yield improvement with NiPtSi formation by laser anneal for advanced low power platform CMOS technology

30. Migrating from planar to FinFET for further CMOS scaling: SOI or bulk?

31. Impact of Epi-Si growth temperature on Ge-pFET performance

32. Junction anneal sequence optimization for advanced high-k / metal gate CMOS technology

34. Single-Metal Dual-Dielectric (SMDD) gate-first CMOS integration towards low VT and high performance

36. Carbon-based thermal stabilization techniques for junction and silicide engineering for high performance CMOS periphery in memory applications

39. Advanced 2D/3D simulations for laser annealed device using an atomistic kinetic Monte Carlo approach and Scanning Spreading Resistance Microscopy (SSRM)

40. Full-field EUV and immersion lithography integration in 0.186μm2 FinFET 6T-SRAM cell

42. Laser-annealed junctions with advanced CMOS gate stacks for 32nm Node: Perspectives on device performance and manufacturability

44. Strain enhanced low-VT CMOS featuring La/Al-doped HfSiO/TaC and 10ps invertor delay

45. Low VT metal-gate/high-k nMOSFETs — PBTI dependence and VT Tune-ability on La/Dy-capping layer locations and Laser annealing conditions

46. Low VT CMOS using doped Hf-based oxides, TaC-based Metals and Laser-only Anneal

47. Impact of sub-melt laser annealing on Si1-xGex source /drain defectivity

48. Widening of FUSI RTP Process Window by Spike Anneal

49. Achieving 9ps unloaded ring oscillator delay in FuSI/HfSiON with 0.8 nm EOT

50. Laser Annealed Junctions: Process Integration Sequence Optimization for Advanced CMOS Technologies

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