Search

Low-dimensional (low-D) semiconductors such as carbon nanotubes (CNTs) and 2-D materials are promising channel materials for nanoscale field-effect transistors (FETs) due to their superior electrostatic control. However, classical scale length theory (SLT) does not incorporate the effect of channel extensions, which becomes crucial for thin channels (< 10 nm) and short gate lengths. Here, we extend the classical SLT by introducing two boundary coupling parameters, which describe the impact of gate and drain biases on the source- and drain-channel junction potentials. Moreover, we introduce a general expression for the scale length specifically for low-D FETs. This extended SLT accurately describes electrostatic short-channel effects (SCEs) of low-D FETs, with < 5% error in subthreshold slope over a wide range of parameters versus > $2\times $ error using the classical SLT. The extended SLT is based on three parameters (scale length, gate, and drain boundary coupling parameters) which can be extracted from potential profiles or FET transfer characteristics. In addition, the extended SLT uses analytical closed-form expressions that can be easily included in a compact model to facilitate design-technology co-optimization (DTCO) with low-D FETs to leverage the crucial role of their extensions. [ABSTRACT FROM AUTHOR]

Carbon nanotube (CNT) transistors exemplify the fundamental tradeoff between desirable high mobility and undesirable leakage current due to the small effective mass and bandgap. To understand leakage current limits in high-speed CNT transistors, electrical bandgaps are extracted on 12 single-CNT top-gate MOSFETs from the energy gap between thermionic emission and band-to-band tunneling (BTBT) at 10 K. At 300 K the minimum IOFF at 0.5 V VDS is analyzed as a function of bandgap between 0.96 eV and 0.43 eV with IOFF-MINfrom 0.2 pA/CNT to 15 nA/CNT. NEGF simulation validates the bandgap extraction methodology and reproduces the experimental MOSFET IOFF-MIN data. A TCAD model calibrated to this work’s leakage data projects the accessible ION-IOFF design space bounded by CNT bandgap, indicating EG > 0.65 eV (dCNT < 1.3 nm) is needed to achieve 100 nA/ $\mu \text{m}$ at 0.5 V VDD and 250 CNT/ $\mu \text{m}$ for channel length above 20 nm. An EG of 1.06 eV (dCNT = 0.8 nm) can deliver $2750\times $ tunable range of IOFF by adjusting VT, which exceeds the $400\times $ tunable range of IOFF used in Si CMOS platform technologies. [ABSTRACT FROM AUTHOR]