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2. Development of the Integration Technologies of Microsystems Based on RF Application

Author

Fan Yichen, Cui Kai, and Hu Yongfang

Subjects
Engineering, Strategic thinking, Packaging engineering, business.industry, Microsystem, Systems engineering, Wireless, Radio frequency, business, Electronic systems, Connotation
Abstract

In the future, electronic system is developing towards higher integration density, higher performance and higher working frequency. Traditional integration and packaging technology will not reach the integration requirement of the novel RF microsystems. The integration technology of RF microsystems is the main method of realizing the requirement of the future electronic system. In this paper, the technology connotation and system of the RF microsystems integration technology is reviewed. The technology challenge and development opportunity is predicted. The strategic thinking of the research on the integration technology of RF microsystems is illustrated.

Published
2020

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