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A variety of Pb-free solders and under bump metallurgies (Cu, Ni, NiP) were investigated for flip chip packaging applications. The result shows that Sn-0.7Cu exhibits the most desirable mechanical properties (shear, tensile, aging, etc.) during deformation under a variety of stress conditions and has the most favorable failure mechanism under both mechanical and thermomechanical stress testing regardless of UBM type. The eutectic Sn-0.7Cu failed through bulk solder while the eutectic Sn-37Pb, Sn-3.5Ag and Sn-3.8Ag-0.7Cu failed at the solder and UBM interface, involving their respective intermetallic compounds. Cu UBM is more favorable for better reliability than NiP UBM from both interface IMC morphology and electromigration points of view. The current carrying capability for all alloys had no failures when stressed up to 2,338 hours at 2.6/spl times/10/sup 4/ A/cm/sup 2/ and 170/spl deg/C. However, when stressed at 5.1/spl times/10/sup 4/ A/cm/sup 2/, there is a significant migration of Pb toward the anode, creating a multiple layered Pb-rich and Sn-rich microstructure. An observation of excessive Ni migration away from the NiP UBM towards the anode after only 30 hours of current stressing at 5.1/spl times/10/sup 4/ A/cm/sup 2/ and 150/spl deg/C raised the reliability concern for solders with NiP UBM, especially for high power applications. The Sn-0.7Cu/Cu UBM and Sn0.7Cu/Ni UBM exhibit greater than 5,300 cycles of thermal fatigue characteristic life under -55/spl deg/C 1+150/spl deg/C and -40/spl deg/C /+125/spl deg/C air-to-air thermal cycling conditions, respectively.

A comprehensive method for testing solder joints under conditions of thermomechanical fatigue is presented. The method involves simultaneous imposition of temperature cycles and strain on discrete solder joints in a shear orientation. The stress, microstructure, and number of cycles to failure were monitored. Cycles to failure were determined by a continuous electrical detection method. 60Sn-40Pb and 40Sn-40In-20Pb solder joints were tested using the proposed method at 20% shear strain. The 60Sn-40Pb alloy has a shorter fatigue lifetime than 40Sn-40In-20Pb. This is attributed to heterogeneous coarsening strain in a small area of the 60Sn-40Pb microstructure. In contrast, the 40Sn-40In-20Pb microstructure becomes refined. The heterogeneous coarsening also results in cyclic softening in 60Sn-Pb, which was not observed in 40Sn-40In-20Pb. Failures initiated within the coarsened band in 60Sn-40Pb at Sn-Sn grain boundaries or phase boundaries. In contrast, failures initiated at the surface of 40Sn-40In-20Pb joints and propagated through both phases of the microstructure. >