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This work introduces the fringe RLGC (i.e., resistance, inductance, conductance, and capacitance) models to accurately compute the broadband S parameters for not only large power planes but also thin signal traces in multi-layered package and PCB environments. With comparable accuracy and 100/spl times/ faster than a 3D full-wave field solver, this technique enables ultra-fast design iterations to optimize the layouts for insertion and return losses, resonance frequencies, and placement of decoupling capacitors, etc.