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1. U-MRAM PUF: A Novel Unipolar-MRAM for Power and Area Efficient Hardware Root of Trust

8. Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer Base Adhesive

22. Status and Performance of Integration Modules Toward Scaled CMOS with Transition Metal Dichalcogenide Channel

23. High-Endurance MoS2 FeFET with Operating Voltage Fess Than IV for eNVM in Scaled CMOS Technologies

28. 14.1 A Software-Assisted Peak Current Regulation Scheme to Improve Power-Limited Inference Performance in a 5nm AI SoC

47. Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process.

48. Identifying Good-Dice-in-Bad-Neighborhoods Using Artificial Neural Networks.

49. Style-exprGAN: Diverse Smile Style Image Generation Via Attention-Guided Adversarial Networks.

50. Digital Phenotyping-Based Bipolar Disorder Assessment Using Multiple Correlation Data Imputation and Lasso-MLP.

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