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We propose Point2Cyl, a supervised network transforming a raw 3D point cloud to a set of extrusion cylinders. Reverse engineering from a raw geometry to a CAD model is an essential task to enable manipulation of the 3D data in shape editing software and thus expand their usages in many downstream applications. Particularly, the form of CAD models having a sequence of extrusion cylinders -- a 2D sketch plus an extrusion axis and range -- and their boolean combinations is not only widely used in the CAD community/software but also has great expressivity of shapes, compared to having limited types of primitives (e.g., planes, spheres, and cylinders). In this work, we introduce a neural network that solves the extrusion cylinder decomposition problem in a geometry-grounded way by first learning underlying geometric proxies. Precisely, our approach first predicts per-point segmentation, base/barrel labels and normals, then estimates for the underlying extrusion parameters in differentiable and closed-form formulations. Our experiments show that our approach demonstrates the best performance on two recent CAD datasets, Fusion Gallery and DeepCAD, and we further showcase our approach on reverse engineering and editing., Comment: CVPR 2022

STT-MRAM is a promising solution for next-generation embedded non-volatile memory (NVM), supporting a wide range of applications. Compared to traditional embedded Flash [1]–[2], STT-MRAM is a CMOS-compatible low-temperature back-end-of-the-line (BEOL) memory, requiring only 2-to-5 extra masks. It is a byte-alterable NVM with excellent write speed, write endurance (>1M cycles), and high-temperature data retention capability. In this work, a 32Mb STT-MRAM using a 0.0456µm2 bit cell is fabricated using a 22nm ultra-low leakage (ULL) CMOS process. A WL-voltage generation system, with distributed local constant-current kickers, and power-gating switches is used to overdrive the WL to achieve a higher read margin, while maintaining low-standby current and fast wake-up. Sense amplifiers (SAs) with segment trimming and adaptive timing control are designed to support reliable reads from −40 to 125°C. A smart write, with multiple write pulses controlled by adaptive write-verify and a temperature compensated write bias, is used for efficient write operation. Magnetic field interference is reduced by six orders of magnitude by adding a shielding film to the packaged die.

A new MRAM reference and sensing circuit that can achieve < ±1μA resolution and 17.5nS read access from −40C to 125C is presented in this paper. A trimmable current-mode latch-type sense amplifier (CLSA) with hybrid-resistance-reference (HRR) and cell location compensation is proposed to resolve small read window of MRAM. Silicon data measurement is presented to demonstrate a logic-process compatible, fully functional 16Mb perpendicular MRAM in 40nm CMOS process.

This study focused on delineating and utilizing habit loop framework: cueing environment, routine, and satisfaction. This study further integrated the habit loop framework into portfolio management game for helping elementary school students to writing and rewriting in order to cultivate good writing habit. We also proposed two design principles: portfolio visualization and management: portfolio visualization and management. The former supported cueing environment; the latter increased satisfaction; students perform their routines (e.g. writing and rewriting) in a portfolio management game.

"Room escape" is a kind of on-line puzzle game, in which players need to exploit their surrounding environment to discover clues for escaping from imprisonment. In recent years, a physical version of "room escape" becomes more and more popular, which transforms the playing paradigm from sitting in front of a computer and clicking the mouse into imprisoning people in a real locked room and having people to find clues by their bare hands. To enable a richer user experience while playing the room escape game in the real world, we proposed, in this work, a new type of playing mode by combining the real world environment with virtual world interactions. That is, a mobile application is developed by integrating both bluetooth-based indoor location and augmented reality (AR) techniques, in which people can play the room escape game with their mobile devices to interact with real world objects within virtual world actions.

We consider a simple fundamental MAC protocol — the slotted ALOHA random access protocol. The stability region can be enlarged by two methods, the cooperation between users and hybrid automatic repeat request (HARQ). The cooperative transmission allows users to exploit cooperative gains in random access networks. The HARQ technique increases the transmission efficiency in retransmission. This idea of introduce cooperation in the slotted ALOHA has been implemented in an earlier work. In this paper, we propose to further integrate HARQ into the slotted ALOHA with cooperation to enlarge the stability region. Mathematical analysis and simulation are provided to describe the two-user stability region. Our simulation is practical cross-layer simulation that uses LDPC code in the physical layer first and then simulates the stability region based on the resultant packet-level phenomenon.

AOP (aspect oriented programming) is a programming paradigm for enhancing the degree of modularity in a system and it helps developers to maintain and manage the system easier. A bad smell means that a bad design that may lead to negative effects while developing a software system. Bad smells may also appear in the system that is developed using AOP paradigm. Therefore, it is important that bad smells can be detected in an AOP-implemented system. In this paper, various types of AOP bad smells are described with its definition and discovering patterns. A two-stage analysis method is proposed for identifying these AOP bad smells in a software system. Furthermore, we provided flow charts that aim to identify these AOP bad smells for helping developers to understand how to extract AOP bad smells.

Galvanic corrosion generally occurred on Al/Cu bond pads post wafer saw resulted in pitting but no pitting was observed at wafer incoming. There is significant interest in the corrosion behavior of Cu-containing Al alloy, such as PL455, which remain of importance for automotive application due to bondability and reliability safety concern. All of pitting existed Cu precipitation on central of pit holes. A simple experiment simplifies galvanic corrosion condition and reveals its mechanism for definition root cause of pitting. Incoming wafer immerse into di-water in various temperature and air/nitrogen dissolved for 40 and 60 minutes. The experiment results conducted that low temperature and nitrogen dissolved into di-water can suppressed galvanic corrosion however it can't be fully suppressed due to halogen residual on bond pad post CF 4 plasma descum (accelerated corrosion rate) and copper precipitation on Al grain boundary during anneal. Copper precipitated in the Al grain boundary that created Al/Cu galvanic potential and interface, which was galvanic corrosion staring point and then galvanic reaction occurred while Al/Cu couple immersed into electrolyte environment which trigger galvanic corrosion. It interprets galvanic corrosion is observed post wafer saw.