1. Dual-attached SMT Capacitor Configurations for Small Form Factor and Single-ended Devices
- Author
-
Amit K. Jain, Chin Lee Kuan, and Sameer Shekhar
- Subjects
business.industry ,Computer science ,Electrical engineering ,Power integrity ,Decoupling capacitor ,Capacitance ,Small form factor ,law.invention ,Capacitor ,Safeguard ,law ,Hardware_INTEGRATEDCIRCUITS ,business ,Decoupling (electronics) ,Jitter - Abstract
Decoupling capacitors are required for power integrity performance. The use of package landside capacitors (LSCs) and/or board backside decoupling imposes significant design constraints on achievable system height. Low realizable capacitance due to limited component area and the need for additional package edge pins are also common design challenges on single-sided devices. On the other hand, due to surface-mount technology yield concern mobile platforms are usually voided on board surface copper layer to safeguard designs from interaction with LSCs causing waste of board resource. This paper presents a new decoupling capacitor technology which enhances capacitor effectiveness enabling single-sided board designs at competitive form factor and reduced system cost. Up to 70% capacitor cost saving and $\sim$16 mm$^{2}$ area shrink are shown feasible in addition to jitter reduction and battery life improvements.
- Published
- 2018