Search

Owing to the strong penetration ability of X-rays and the imaging visibility, X-ray inspection has been gradually applied to power grids. However, various problems occur in the promotion and application of X-ray inspection in ultra high voltage gas-insulated switchgear (UHV GIS) owing to its large size. These problems relate to parameter selection, photography, protection area, random defect recognition, and risk assessment based on the X-ray image. In this paper, an X-ray digital imaging system is set up for UHV GIS inspection. Parameter selection for UHV GIS is discussed, and we demonstrate that UHV GIS can be photographed under a source-to-detector distance (SDD) of 2.8 m, a tube voltage of 300 kV, and an exposure of >240 mA·s. A photographic method for UHV GIS, entailing adjustment of the position of the imaging plate with a fixed position of the X-ray generator, is proposed to reduce the difficulty in image stitching. The influence of the parameters on imaging quality is discussed, and we show that the brightness and contrast increase with increasing exposure or decreasing SDD. The interactions between parameters are qualitatively introduced. Moreover, the sensitivity of X-ray inspection in UHV GIS is studied under selected parameters, and the sensitivity of X-ray inspection to copper particles and aluminum particles in UHV GIS are shown to be <0.7 mm and <1.1 mm, respectively. Radiation protection for operators is also discussed. In addition, a pseudo-color scheme for identifying random tiny defects is proposed to reduce human error. Finally, the risk level of defects with X-ray inspection is defined by size feature. [ABSTRACT FROM AUTHOR]

The lifetime tests for High Voltage Ceramic Capacitors (HVCC) were investigated under repetitive frequency operation at 25 Hz and three kinds of failure modes were summarized. The significant innovation of this paper is testing HVCC, made in the laboratory, under repetitive pulses and proposing several effective improvement methods. The results show that the lifetime of HVCC meets inverse power-law with the applied voltage and the voltage acceleration factor is about 5.8. Failure modes of HVCC are inner breakdown of ceramic dielectric, interface breakdown of ceramic-epoxy and abscission of brass terminals. The inner breakdown is in connection with abrupt destructive discharge under much higher stress while the interface breakdown is related to interface delamination and development of electrical trees in relatively low strength. The third failure mode is always caused by high current density. Based on the failure modes, several methods were taken to improve the performance of HVCC, which included coating semiconductor at the edge of silver layers, adding coupling agent to ceramic-epoxy interface and improving the structure of brass terminals. The lifetime of HVCC under repetitive frequency operation has been extended greatly from 103 shots to more than 105 shots after the investigation and improvement. [ABSTRACT FROM AUTHOR]