101. Stress Intensity Factor for Interface Cracks in Bimaterials Using Complex Variable Meshless Manifold Method
- Author
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Hongfen Gao and Gaofeng Wei
- Subjects
Article Subject ,Interface (Java) ,business.industry ,lcsh:Mathematics ,General Mathematics ,Mathematical analysis ,General Engineering ,Structural engineering ,lcsh:QA1-939 ,Span (engineering) ,Domain (mathematical analysis) ,Displacement (vector) ,Manifold ,lcsh:TA1-2040 ,lcsh:Engineering (General). Civil engineering (General) ,business ,Stress intensity factor ,Variable (mathematics) ,Mathematics - Abstract
This paper describes the application of the complex variable meshless manifold method (CVMMM) to stress intensity factor analyses of structures containing interface cracks between dissimilar materials. A discontinuous function and the near-tip asymptotic displacement functions are added to the CVMMM approximation using the framework of complex variable moving least-squares (CVMLS) approximation. This enables the domain to be modeled by CVMMM without explicitly meshing the crack surfaces. The enriched crack-tip functions are chosen as those that span the asymptotic displacement fields for an interfacial crack. The complex stress intensity factors for bimaterial interfacial cracks were numerically evaluated using the method. Good agreement between the numerical results and the reference solutions for benchmark interfacial crack problems is realized.
- Published
- 2014