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Objective. The aim of the study is to develop a computational model of a thermoelectric system (TPS) for cooling discrete semiconductor devices (DSD), implemented in the Elcut application software package, and to conduct a corresponding numerical experiment on it.Method. A new type of DPP cooling system has been developed, which uses several TEM sections that provide heat removal from both the lower and upper surfaces of the fuel elements, which increases the heat exchange surface between the cold source and the REE element and increases the heat removal efficiency. Using the finite element method, a computational model of this system is constructed based on the solution of the problem of thermal conductivity for a multi-element structure of a complex configuration, each component of which is characterized by thermal and electrical parameters.Result. A numerical experiment was carried out using the calculation model. As a result of it, the results of a numerical experiment were obtained in the form of a three-dimensional picture of the temperature field of the DPP - TPP system when it reaches the stationary mode, as well as graphs of temperature changes over time in the center of discrete semiconductor devices at various values of the cooling capacity of the thermoelectric module (TEM).Conclusion. As a result of the numerical experiment, it was found that the proposed design of the cooling TPP fully allows solving the problem of ensuring the required temperature regime of the DPP in the range of its power up to 75 W. At the same time, the use of sections of thermoelectric modules from thermoelements identical in their geometric, electrical and thermal characteristics makes it possible to increase the manufacturability of the device, as well as to ensure its operation in optimal current modes.

Objective. The objective of the study is to develop a design model of the electronic equipment cooling system based on the combined use of high-current thermoelectric semiconductor batteries of layered design and an evaporative-condensing thermal thermosyphon, as well as to study the thermophysical processes occurring during its operation.Methods. A mathematical model of the electronic equipment cooling system based on the combined use of high-current layered thermoelectric batteries and an evaporative-condensing thermal thermosyphon is presented. The design model includes a description of heat exchange processes in a layered thermoelectric element at various supply currents, determination of the amount of heat transferred through the cross-section of the channel of a thermal thermosyphon per unit of time, and the temperature values at each channel point.Result. A 2D dynamic heat conduction problem is solved for a complex system with rectangular geometry of fragments and heat sources. The temperature distribution of a thermoelement along its longitudinal axis at different values of the supply current and the change in the heat flow along its length in a thermal evaporation-condensation thermosyphon are studied.Conclusion. The results of the research have shown the effectiveness of combined use of high-current layered thermoelectric batteries and a thermal thermosyphon in electronic equipment with dense element packaging. It is shown that to increase the efficiency of electronic equipment and reduce the heat losses that occur in the heat line when the heat-generating element of radio-electronic equipment and thermoelectric semiconductor batteries are separated by a sufficiently large distance (over 0.6 m), it is advisable to use an evaporative-condensing thermal thermosyphon as a heat line.

Aim. The aim of the study is to analyse the problem of heat dissipation in high-power transistors and develop devices for their thermal stabilisation when used in electronic equipment. Method. A method is proposed for testing power transistors using a device to to ensure thermal stabilisation in the stating volume by means of a two-position temperature controller along with a model for the use of these components in electronic devices. The proposed devices support high thermal stabilisation accuracy of power transistors in a radioelectronic device system allowing temperature to be maintained at a given level with high accuracy by means of a thermoelectric battery. Results. Device designs were developed for increasing the accuracy of thermal stabilisation of power transistors with high efficiency, low energy consumption and small size. Conclusion. Based on the results of experimental studies, optimal designs for devices for the thermostabilisation of radioelectronic device components that dissipate significant power during their operation are presented. The devices can be used to increase the accuracy of thermal stabilisation of the radioelectronic device element by means of a working substance whose melting point coincides with its thermal stabilisation temperature. The developed devices have the following functions: the thermoelectric battery sections of the thermoelectric battery will be sequentially disconnected depending on the electrical signals from the temperature sensors to which the solid phase of the working substance has moved. The battery of the thermoelectric module (TEM) removes excess heat from the heat-stabilising substance while maintaining the required temperature of the radioelectronic device element. Excess heat from the heat-generating junctions of the TEM battery is removed by the heat exchanger. During melting of the working substance, the temperature of the thin-walled metal container – and, accordingly, the temperature of the CEA element – can be maintained at a constant value equal to the melting temperature of the working substance.

Objectives. The article discusses a thermoelectric cooling system (TECS) for ensuring the thermal regime of modular electronic equipment (MEE) located in a cabinet. The main task of the experimental studies is to determine the temperature dependencies of the air-cooled heat-generating elements of a printed circuit board simulator according to TEСS parameters.Method. In order to conduct experimental studies of a thermoelectric cooling system for printed circuit boards in cassette units using a thermoelectric cooling system, a prototype designed and manufactured in the laboratory was studied on a testing stand.Result. The directions of constructive solutions for using a TECS device are presented along with a description of the testing stand and procedure. The dependencies of the temperature of the printed circuit board simulator on the heat power taken away by the TECS are considered along with the temperatures of hot and cold junctions, the air flow velocity and the distance between the electronic boards.Conclusion. The operability of the developed MEE cooling system is confirmed by the experimental studies; the specified cooling method has advantages over conventional forced or natural method and can achieve the temperatures required by the technical operating conditions; when choosing a fan to provide forced circulation of the air flow in the system, it is necessary to take into account the speed of the air flow in the channel; it is necessary to reserve the power of the power supply for the TECS operation in proportion to the power of the heat sources. An important additional point for the functioning of the thermoelectric cooling device is the necessity of ensuring the effective removal of heat from the hot junctions of the thermoelectric module without which it is impossible to use the proposed system.

Objectives. The aim of the study is to develop a computational model of the system of thermal stabilization of elements of electronic equipment (REA), based on the joint use of working substances with a stable melting point and the liquid method of heat sink, the study of the thermophysical processes occurring during its operation.Method.A computational model of the REA thermostabilization system based on the use of working substances with a stable melting point has been created. The model includes a description of the heat exchange processes during laminar fluid motion in a heat exchanger, determining the duration of stable operation of the REA elements, depending on the flow rate and cooling capacity of a thermoelectric battery (TEB).Result.The graphs of dependences reflecting the main characteristics of the developed system were obtained, in particular, the dependence of the change in the duration of maintaining the stable temperature of the REA element on its power, the temperature of the cold junctions of the thermopile, scattering at different maximum flow rates of the heat exchanger.Conclusions.The results of the calculations determine that the duration of complete penetration of the working substance, corresponding to the duration of stable operation of CEA elements, can be within the required limits only if certain very specific conditions are met: using a sufficient amount of the working substance in the heat stabilizing system, corresponding to the temperature and flow rate of the liquid in the heat exchanger. These parameters of the thermal stabilization system must be selected based on the amount of heat emitted per unit of time by the REA element, the duration of its operation, and the characteristics of the thermopile used to cool the fluid.