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1. In-line metrology for characterization and control of extreme wafer thinning of bonded wafers.

Author

LIEBENS, M., JOURDAIN, A., DE VOS, J., VANDEWEYER, T., MILLER, A., BEYNE, E., LI, S., BAST, G., STOERRING, M., HIEBERT, S., and CROSS, A.

Subjects
*SEMICONDUCTOR wafers, *MICROELECTRONICS, *SEMICONDUCTOR storage devices, *TECHNOLOGY, *MANUFACTURING processes
Abstract

The article reports on the pathfinding and development of the extreme semiconductor wafer thinning process by using the in-line metrology methods. It examines where the extreme wafer thinning process can be improved. It is said that different thinning techniques like grinding, polishing and etching were evaluated during the extreme wafer thinning process pathfinding and development.

Published
2017

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