1. Fusion bonding for next-generation 3D-ICs.
- Author
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UHRMANN, THOMAS, MATTHIAS, THORSTEN, WAGENLEITNER, THOMAS, and LINDNER, PAUL
- Subjects
- *
SEMICONDUCTOR wafer bonding , *THREE-dimensional display systems , *INTEGRATED circuits , *FABRICATION (Manufacturing) , *SEMICONDUCTOR wafers - Abstract
The article discusses the potential of the wafer bonding technology for the achievement of improved accuracy for bond alignment. Topics include the increase chip performance offered by three-dimensional integrated circuit (3D-IC), the establishment of some 3D-IC in the middle of the fabrication process, and the transformation of the bonding materials to achieve the successful fusion bonding.
- Published
- 2014