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Purpose The purpose of this paper is to propose a simplified representation of the fire load in computational fluid dynamics (CFD) to represent the effect of large-scale travelling fire and to highlight the relevance of such an approach whilst coupling the CFD results with finite element method (FEM) to evaluate related steel temperatures, comparing the numerical outcomes with experimental measurements. Design/methodology/approach This paper presents the setup of the CFD simulations (FDS software), its corresponding assumptions and the calibration via two natural fire tests whilst focusing on gas temperatures and on steel temperatures measured on a central column. For the latter, two methods are presented: one based on EN 1993-1-2 and another linking CFD and FEM (SAFIR® software). Findings This paper suggests that such an approach can allow for an acceptable representation of the travelling fire both in terms of fire spread and steel temperatures. The inevitable limitations inherent to the simplifications made during the CFD simulations are also discussed. Regarding steel temperatures, the two methods lead to quite similar results, but with the ones obtained via CFD–FEM coupling are closer to those measured. Originality/value This work has revealed that the proposed simplified representation of the fire load appears to be appropriate to evaluate the temperature of steel structural elements within reasonable limits on computational time, making it potentially desirable for practical applications. This paper also presents the first comparisons of FDS–SAFIR® coupling with experimental results, highlighting promising outcomes.

PurposeThe ever present need for the miniaturization of electronic assemblies has driven the size of passive components to as small as the 01005 package size. However, the packaging standards for these components are still under development. The purpose of this work is to report results from experiments designed to establish optimum process parameters, pad sizes and component clearances for the surface mounting of 01005 passive components.Design/methodology/approachThe experiments were designed using MODDE, an experimental design software tool, and were carried out with both 01005 capacitors and resistors. All the assembled components were examined under microscope and judged according to industrial workmanship standards.FindingsIt was found that a viable solder paste printing process for the assembly of 01005 components can be achieved with a 75 μm thick stencil. Type 5 solder paste achieved a similar printing performance to type 4. Under the experimental conditions used, the optimum pad dimensions for the 01005 capacitors were 210 μm length, 220 μm width, 160 μm separation and for the resistors were 190 μm length, 220 μm width, 160 μm separation. The smallest component clearance to reliably avoid bridging was found to be 100 μm. A high placement force of 3.5 N was found to cause cracking of 01005 resistors.Originality/valueFrom this work, a surface mount process for 01005 passive components is established and it is concluded that electronics packaging density can be increased through the assembly of these small components. In the near future, the widespread use of them will definitely facilitate a further reduction in the size of electronic assemblies, especially in handheld and portable devices.