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Advanced Encryption Standard (AES) has replaced its predecessor, Double Encryption Standard (DES), as the most widely used encryption algorithm in many security applications. Up to today, AES standard has key size variants of 128, 192, and 256-bit, where longer bit keys provide more secure ciphered text output. In the hardware perspective, bigger key size also means bigger area and power consumption due to more operations that need to be done. Some companies that employ ultra-high security in their systems may look for a key size bigger than 256-bit AES. In this paper, 128 and 256-bit AES hardware, as well as two variants of an AES encryption algorithm for 512-bit and 1024-bit key size, are implemented and compared in terms of power consumption and area. The experiment is done in 45 nm CMOS technology at 1.1 V using a Synopys DC Compiler and Modelsim and total power consumption and area results are presented and graphically compared.

In network data analysis, research about how accurate the estimation model represents the universe is inevitable. As the speed of the network increases, so will the attacking methods on future generation communication network. To correspond to these wide variety of attacks, intrusion detection systems and intrusion prevention systems also need a wide variety of counter measures. As a result, an effective method to compare and analyze network data is needed. These methods are needed because when a method to compare and analyze network data is effective, the verification of intrusion detection systems and intrusion prevention systems can be trusted. In this paper, we use extractable standard protocol information of network data to compare and analyze the data of MIT Lincoln Lab with the data of KDD CUP 99 (modeled from Lincoln Lab). Correspondence Analysis and statistical analyzing method is used for comparing data.

Knowledge of the Mg–B binary phase diagram is important in for the synthesis of superconducting MgB2 and of potential, new Mg–B alloys. However, the literature phase diagram is highly uncertain because it was originally constructed by guessing the decomposition temperatures of magnesium boride phases. We therefore utilized the CALPHAD method and ab initio calculations to compute thermodynamic model parameters to determine the decomposition temperatures of magnesium borides and re-assess the Mg–B binary phase diagram.

A new life function based on a model for the creep–fatigue life prediction in terms of stress relaxation during hold time has been proposed. From the concept that the reduction of fatigue life with hold time is due to the creep effect of stress relaxation that results in the additional energy dissipation in the hysteresis loop, the relaxed stress range is suggested to be a creep–fatigue damage function. The plastic strain range (Δɛp) exhibiting a functional correlation of both strain and time requires experimental efforts following Coffin–Manson relationship [L.F. Coffin Jr., Trans. ASME 76 (1954) 931–950; S.S. Manson, NASA Technical Note 2933, NASA Research Center, Cleveland, OH, 1954] upon applied creep–fatigue conditions. After the new concept was applied to the relationship, all the Coffin–Manson plots at the various levels of hold time under strain-controlled fatigue tests were identified as a linear relationship with relaxed stress range (Δσ) and fatigue life (Nf). The normalized creep–fatigue life prediction model, which can be applied to high temperature materials regardless of the fracture morphology is presented in view of a real situation.

The fracture behaviors of laminated composites of bulk metallic glass (BMG (Vitreloy1))/crystalline layer have been examined via both experimental and simulation approaches. The specimen array of BMG/Zr/BMG by an electron-discharge bonding technique showed a completed bonding, and the fracture tests showed that when the number of BMG layer increases up to three layers, the fracture energy for the laminated specimen is increased. The simulation results of the laminated composite exhibited that the enhancement of fracture energy for the composites is mainly due to the shear stress distribution through the interface between BMG layers.