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Start Over Author "Huang, Haiyou" Publisher elsevier bv
17 results on '"Huang, Haiyou"'

12. Effects of room-temperature deformation on mechanical properties, microstructure and texture of continuous columnar-grained BFe10-1-1 cupronickel alloy tubes

Author

Liu Xuefeng, Gan Chunlei, Huang Haiyou, and Xie Jian-xin

Subjects
Materials science, Mechanical Engineering, Metallurgy, Alloy, engineering.material, Deformation (meteorology), Condensed Matter Physics, Microstructure, Cupronickel, Mechanics of Materials, Volume fraction, Ultimate tensile strength, engineering, General Materials Science, Grain boundary, Texture (crystalline)
Abstract

The effects of room-temperature deformation on mechanical properties, the microstructure and texture evolution of continuous columnar-grained BFe10-1-1 cupronickel alloy tubes during room-temperature rolling and drawing were investigated. The results showed that continuous columnar grains were gradually thinned down into fiber microstructure, and the degree of working-hardening of the BFe10-1-1 alloy was increased continually with the increase of room-temperature reduction during rolling and drawing. After the rolling deformation degree of 82.8%, the ultimate tensile strength (UTS) of the BFe10-1-1 cupronickel alloy tubes increased to 418.7 MPa from 212.0 MPa of the as-cast state, and the elongation (El) of 8.5% was still obtained. The as-rolled BFe10-1-1 cupronickel alloy tubes were further drawn to the deformation degree of 99.0%, and the ultimate tensile strength (UTS) increased to 603.7 MPa and the elongation (El) reduced to 2.2%. The excellent room-temperature extensibility of the continuous columnar-grained BFe10-1-1 cupronickel alloy tubes is significantly beneficial from the relative high volume fraction of the texture as well as low angle boundary.

Published
2013
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13. Cu diffusion kinetics in (Cu, Ni)3Sn intermetallic compound nanolayers investigated by an Energy-Dispersive-X-ray-based permeation test

Author

Liu, Lilin, Huang, Haiyou, Fu, Ran, Liu, Deming, Zhang, Tongyi, Liu, Lilin, Huang, Haiyou, Fu, Ran, Liu, Deming, and Zhang, Tongyi

Abstract

The Energy-Dispersive-X-ray-based permeation and oxidation test has been further developed by an improved theoretical analysis, in which chemical potential gradients rather than concentration gradients are employed. The developed test is able to characterize diffusion kinetics in diffusion barriers at the nanometer scale. The Cu flux coefficient in (Cu, Ni)(3)Sn intermetallic compound nanolayers was determined from the test to be 8.48 x 10(-15) mol.(m.s.J/mol)(-1) exp(-52.3 kJ.mol(-1)/RT) in a temperature range of 250 degrees C-400 degrees C. (C) 2009 Elsevier B.V. All rights reserved.

Published
2009

14. DO22-(Cu,Ni)3Sn intermetallic compound nanolayer formed in Cu/Sn-nanolayer/Ni structures

Author

Liu, Lilin, Huang, Haiyou, Fu, Ran, Liu, Deming, Zhang, Tongyi, Liu, Lilin, Huang, Haiyou, Fu, Ran, Liu, Deming, and Zhang, Tongyi

Abstract

The present work conducts crystal characterization by High Resolution Transmission Electron Microscopy (HRTEM) on Cu/Sn-nanolayer/Ni sandwich structures associated with the use of Energy Dispersive X-ray (EDX) analysis. The results show that DO22-(Cu,Ni)(3)Sn intermetallic compound (IMC) ordered structure is formed in the sandwich structures at the as-electrodeposited state. The formed DO22-(Cu,Ni)(3)Sn IMC is a homogeneous layer with a thickness about 10 nm. The DO22-(Cu,Ni)(3)Sn IMC nanolayer is stable during annealing at 250 degrees C for 810 min. The formation and stabilization of the metastable DO22-(Cu,Ni)(3)Sn IMC nanolayer are attributed to the less strain energy induced by lattice mismatch between the DO22 IMC and fcc Cu crystals in comparison with that between the equilibrium DO3 IMC and fcc Cu crystals. (C) 2009 Elsevier B.V. All rights reserved.

Published
2009

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