1. High speed test interface module using MEMS technology
- Author
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Nabeeh Kandalaft, Rashid Rashizadeh, and Ali Attaran
- Subjects
Microelectromechanical systems ,Engineering ,business.industry ,Electronic test equipment ,Electrical engineering ,Hardware_PERFORMANCEANDRELIABILITY ,Integrated circuit ,Condensed Matter Physics ,Atomic and Molecular Physics, and Optics ,Die (integrated circuit) ,Surfaces, Coatings and Films ,Electronic, Optical and Magnetic Materials ,law.invention ,Automatic test equipment ,law ,Distortion ,Hardware_INTEGRATEDCIRCUITS ,Electronic engineering ,Device under test ,Signal integrity ,Electrical and Electronic Engineering ,Safety, Risk, Reliability and Quality ,business - Abstract
At frequencies above a few gigahertz, testing integrated circuits becomes a challenging task. Test signal integrity degradation due to parasitic effects of interconnects and electromagnetic coupling undermine the test results and increase the yield loss of integrated circuits at high speeds. A new test interface module based on MEMS technology is proposed in this paper. High-speed micro test-channels are designed to establish connectivity between the device under test and the tester at the die level. Experimental results indicate that the proposed architecture can be used to test integrated circuits up to 50 GHz without much loss or distortion.
- Published
- 2015
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