1. Model for surface topography prediction in the ultra-precision grinding of silicon wafers considering volumetric errors.
- Author
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Cai, Yindi, Yang, Yang, Wang, Yuxuan, Wang, Ronghao, Zhu, Xianglong, and Kang, Renke
- Subjects
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SURFACE topography , *SILICON wafers , *GRINDING machines , *LASER measurement , *MEASUREMENT errors , *PREDICTION models - Abstract
• A model for wafers surface topography prediction in the ultra-precision grinding considering volumetric errors is proposed. • An HTM-based volumetric error model is optimized considering Abbe and Bryan errors induced while measuring errors. • On-machine measurement of translational axes' geometric errors is realized using an author's group developed system. • The predicted and experimental wafer surface topographies are in reasonable agreement with each other. Ultra-precision grinding machine is widely used for thinning silicon wafers. The wafer surface quality is considerably affected by volumetric errors at the functional point of the ultra-precision grinding machine. Therefore, a volumetric error model is established based on the homogeneous transformation matrix (HTM) method. The model is, then, optimized by considering Abbe and Bryan errors induced volumetric errors during the error measurements process. A prediction model for the wafer surface topography is established by combining the manufacturing mechanism of the ultra-precision grinding and the optimized volumetric error model of the ultra-precision grinding machine. Volumetric errors are detected using an author's group developed laser measurement system and a commercial spindle error analyzer. The model enables to predict the topography and total thickness variation (TTV) of the wafer surface. A group of grinding experiments are performed to verify the effectiveness of the proposed models. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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