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Start Over Author "Satoh T" Publisher elsevier b.v.
259 results on '"Satoh T"'

25. Solar wind control of Jupiter's H3 auroras

Author

Baron, R.L., Owen, T., Connerney, J.E.P., Satoh, T., and Harrington, J.

Subjects
Jupiter (Planet) -- Research, Solar wind -- Research, Auroras -- Research, Astronomy, Earth sciences
Abstract

A program of observations of Jupiter's [Mathematical Expression Omitted] auroras was conducted during the first 4 months of 1992, a period that spanned the Ulysses encounter. Daily variations of auroral intensity are small in magnitude ([approximately]20%) and well correlated with variations in the solar wind ram pressure arriving at Jupiter. A much larger (factor of 3) time variation is observed to occur on a time scale of approximately 2 months. During the first 2 months of observation, the inferred total intrinsic intensity of the northern aurora exceeded that of the southern aurora by a factor of 2. Throughout the latter 2 months, characterized by less intense auroral activity, the intensity of the northern aurora was comparable to that of the southern aurora.

Published
1996

42. Activation of innate immunity by 14-3-3 ε, a new potential alarmin in osteoarthritis.

Author

Millerand, M., Sudre, L., Nefla, M., Pène, F., Rousseau, C., Pons, A., Ravat, A., André-Leroux, G., Akira, S., Satoh, T., Berenbaum, F., and Jacques, C.

Abstract

Objective: The innate immune system plays a central role in osteoarthritis (OA). We identified 14-3-3ε as a novel mediator that guides chondrocytes toward an inflammatory phenotype. 14-3-3ε shares common characteristics with alarmins. These endogenous molecules, released into extracellular media, are increasingly incriminated in sustaining OA inflammation. Alarmins bind mainly to toll-like receptor 2 (TLR2) and TLR4 receptors and polarize macrophages in the synovium. We investigated the effects of 14-3-3ε in joint cells and tissues and its interactions with TLRs to define it as a new alarmin involved in OA.Design: Chondrocyte, synoviocyte and macrophage cultures from murine or OA human samples were treated with 14-3-3ε. To inhibit TLR2/4 in chondrocytes, blocking antibodies were used. Moreover, chondrocytes and bone marrow macrophage (BMM) cultures from knockout (KO) TLRs mice were stimulated with 14-3-3ε. Gene expression and release of inflammatory mediators [interleukin 6 (IL-6), monocyte chemoattractant protein-1 (MCP-1), tumor necrosis factor alpha (TNFα)] were evaluated via reverse transcription quantitative polymerase chain reaction (RT-qPCR) and ELISA.Results: In vitro, 14-3-3ε induced gene expression and release of IL6 and MCP1 in the treated cells. The inflammatory effects of 14-3-3ε were significantly reduced following TLRs inhibition or in TLRs KO chondrocytes and BMM.Conclusions: 14-3-3ε is able to induce an inflammatory phenotype in synoviocytes, macrophages and chondrocytes in addition to polarizing macrophages. These effects seem to involve TLR2 or TLR4 to trigger innate immunity. Our results designate 14-3-3ε as a novel alarmin in OA and as a new target either for therapeutic and/or prognostic purposes. [ABSTRACT FROM AUTHOR]

Published
2020
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48. Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding.

Author

Usui, M., Satoh, T., Kimura, H., Tajima, S., Hayashi, Y., Setoyama, D., and Kato, M.

Subjects
*THERMAL stresses, *THERMAL properties of nanoparticles, *SYNCHROTRON radiation sources, *THERMAL properties, *NANOSTRUCTURED materials
Abstract

The effects of high-temperature aging on a novel hybrid bonding layer were investigated. The hybrid layer, which consisted of Cu nanoparticles and a eutectic Bi-Sn solder powder, was formed by a sintering reaction of the solid-phase Cu nanoparticles and a chemical reaction involving the liquid-phase Bi and Sn in combination. The layer was used to bond a SiC chip to a direct bonded aluminum substrate. A conventional Cu nanoparticle-based bonding layer was also prepared as a reference. Samples with these bonding layers were evaluated using the thermal aging test (225 or 250 °C, 100 h). Bonding strength and synchrotron radiation computed laminography (SRCL) measurements were performed both before and after the thermal aging test. It was observed that thermal aging greatly decreased the bonding strength of the conventional layer. In contrast, the bonding strength of the hybrid layer was reduced only slightly by the thermal aging treatment. SRCL images showed that the conventional layer exhibited numerous cracks, which acted as passages for oxidation. On the other hand, in the hybrid layer, the liquid-phase Bi and Sn densified the Cu sintering phase through the formation of an alloyed Cu-Sn phase. As a result, the hybrid layer contained fewer passages for oxidation as compared to the conventional layer and maintained its bonding strength even against thermal aging. Therefore, the hybrid layer, which is highly stable against thermal aging, will be useful for the high-temperature operation of intelligent power modules. [ABSTRACT FROM AUTHOR]

Published
2017
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