5 results on '"Lin, Pengrong"'
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2. Mechanical properties and microstructure evolution of Sn–Bi-based solder joints by microalloying regulation mechanism
3. Improved shear property of Sn-3.0Ag-0.5Cu/Ni micro solder joints under thermal shock between 77 K and 423 K by adding TiO2 nanoparticles
4. Microstructural evolution of joints with and without Sb, Ni in Sn58Bi solder under electro-thermal-force coupling
5. Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing
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