1. Direct integration of dielectric all-ceramic thick films on a polymer substrate using room temperature fabrication.
- Author
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Väätäjä, Maria, Kähäri, Hanna, Ohenoja, Katja, Juuti, Jari, and Jantunen, Heli
- Subjects
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THICK films , *POLYMER films , *SILK screen printing , *ANTHOLOGY films , *PERMITTIVITY , *CERAMIC powders - Abstract
• All-ceramic composite thick films seamlessly integrated with a polymeric substrate. • Simple method for manufacture all-ceramic thick films. • Printable ceramic pastes realized without the use of organic additives or vehicles. • High temperature processing not needed. Direct integration of all-ceramic thick films and a polymer substrate has been realized for the first time without high temperature processing using the Room Temperature Fabrication method. Printable Li 2 MoO 4 -BaTiO 3 composite pastes with 0, 10, and 20 vol.% of BaTiO 3 were fabricated from the respective ceramic powders and water without organic additives or vehicles. The pastes were stencil printed on a polyimide substrate and dried at 120 °C without pressing or lamination. Using scanning electron microscopy, the films were observed to be in seamless contact with the substrate and to have a uniform microstructure. Relative permittivities of the ceramic films increased from 4.2 to 7.2 (at 2.5 GHz) and 4.5 to 7.5 (at 9.9 GHz) according to the vol.% content of the added BaTiO3, with corresponding dielectric losses from 10−3 to 10-2. The results show that the room temperature fabrication method enables 2D printing of all-ceramic thick films on temperature-sensitive substrates. [ABSTRACT FROM AUTHOR]
- Published
- 2020
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