1. Microstructure, joining mechanism, mechanical properties and optimization of inactive solder (Sn9Zn) in low temperature ultrasonic soldering of AlN ceramics and 2024Al.
- Author
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Fan, Zongkai and Chen, Chao
- Subjects
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ELECTRONIC packaging , *THERMAL stresses , *CERAMIC materials , *STRAINS & stresses (Mechanics) , *AIR conditioning , *SOLDER & soldering - Abstract
With the development of the electronic packaging industry, there is an increased demand for enhanced strength in DBA substrates. Ultrasonic soldering technology allows low-temperature joining of ceramic-metal materials under ambient air conditions. In this paper, we successfully achieved the joining between AlN ceramics and 2024Al using Sn9Zn solder and ultrasonic soldering technique, while also analyzing the joining mechanism through Comsol software simulations. It was observed that under the appropriate ultrasonic amplitude and frequency, the Sn9Zn solder exhibited complete wetting with both base materials, resulting in reliable joints. Building upon this finding, the conventional Sn9Zn solder was further optimized by adding Sb element. The addition of Sb element led to the formation of Zn 4 Sb 3 phase and β-Sn(Sb) phase with Sb acting as solute. Among them, the generation of β-Sn(Sb) solid solution phase effectively improved the joint strength. The maximum joint strength was achieved at an average value of 75.066 MPa when the Sb content reached 1 wt. %. At this point, the failure occurred within the AlN ceramic base material. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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