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Abstract: Thin film of non-polymeric organic compound pyronine-B has been fabricated on moderately doped (MD) n-InP substrate as an interfacial layer using spin coating technique for the electronic modification of Au/MD n-InP Schottky contact. The electrical characteristics have been determined at room temperature. The barrier height and the ideality factor values for Au/pyronine-B/MD n-InP Schottky diode have been obtained from the forward bias I–V characteristics at room temperature as 0.60eV and 1.041; 0.571 and 1.253eV after annealing at 100 and 250°C, respectively. An increase in annealing temperature at the Au/n-InP Schottky junction is shown to increase the reverse bias leakage current by about one order of magnitude and decrease the Schottky barrier height by 0.027eV. Furthermore, the barrier height values for the Au/pyronine-B/MD n-InP Schottky diode have also been obtained from the C–V characteristics at room temperature as 1.001 and 0.709eV after annealing at 100 and 250°C, respectively. Finally, it was seen that the diode parameters changed with increase in the annealing temperature. [ABSTRACT FROM AUTHOR]

Logistics determines not only the possibility of developing the economy of the domestic sector, but also allows to identify opportunities for generating benefits for a country with a transition economy. In particular, logistic complexes should ensure continuous development on the basis of actions and determine the possibility of reducing the maximum amount of downtime when a larger number of participants in the transport chain are involved. The relevance of the present study is determined by the fact that a considerable number of solutions for logistics chains use only the mechanism of economic benefits without optimizing the engineering component. The novelty of this study is that the logistics chain is presented as a comprehensive engineering project that can be implemented on the basis of optimization solutions for the components used. The use of such tools can be based not only on the principles of a direct engineering solution, but also on local micro-logistical systems. The economic rationale for the proposed system and its elements is provided. Practical use of the proposed solution can be implemented on the principles of integration into large industrial systems. The study can be extended to the application of technologies of decentralized logistical systems. [ABSTRACT FROM AUTHOR]