1. Galectin expression in healing wounded skin treated with low-temperature plasma: Comparison with treatment by electronical coagulation.
- Author
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Akimoto Y, Ikehara S, Yamaguchi T, Kim J, Kawakami H, Shimizu N, Hori M, Sakakita H, and Ikehara Y
- Subjects
- Animals, Cold Temperature, Electrocoagulation, Female, Gene Expression Regulation, Immunohistochemistry, Mice, Mice, Inbred C57BL, Microscopy, Electron, Transmission, Microscopy, Immunoelectron, Signal Transduction, Skin metabolism, Skin pathology, Smad Proteins metabolism, Galectin 1 metabolism, Galectin 2 metabolism, Galectin 3 metabolism, Plasma Gases therapeutic use, Wound Healing
- Abstract
Low-temperature plasma is useful for the care of wounded skin. It accelerates wound healing. However, the mechanism of this effect has not been fully elucidated yet. Galectin-1 is reported to accelerate wound healing via the Smad signaling pathway. In the present study to clarify whether or not galectins were expressed during the process of wound healing in the plasma-treated skin, we examined the effect of low-temperature plasma on galectin expression in the healing skin. We compared the effects of low-temperature plasma on the expression of galectin-1, -2, and -3 in the healing skin with those of electrocoagulation conducted with a high-frequency electrical coagulator. Immediately after the start of low-temperature plasma treatment following the incision made in the skin, a membrane-like structure was formed on the surface of the wound. Immunoelectron microscopy showed that these galectins were localized in the membrane-like structure of the plasma-treated skin. The expressions of these galectins were increased by the low-temperature plasma treatment, whereas they were inhibited by the electrocoagulation. These results suggest that galectins were involved in the wound healing of low-temperature plasma-treated skin. Galectins will thus be good markers for further examination of the effects of low-temperature plasma on the healing of wounded skin., (Copyright © 2016 Elsevier Inc. All rights reserved.)
- Published
- 2016
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