Descriptor: "Packaging Density" / Publisher: dempa publication inc. (japan) - Searchworks@Jio Institute Digital Library Search Results

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Your search keyword '"Packaging Density"' showing total 16 results

Start Over Descriptor "Packaging Density" Publisher dempa publication inc. (japan)

16 results on '"Packaging Density"'

1. 8mm Video Tape Technology: A Look at the Future

Subjects: Technology, Performance Improvement, Packaging Density, Videotape Recorders, State-of-the-Art, Increase, Future Technologies, Video Systems, Storage Density
Published: 1984

2. Many Layers of Reasons for Choosing a Hybrid Integrated Circuit

Subjects: Hybrid Circuits, Integrated Circuits, Performance Improvement, Low Cost, Packaging Density, Increase, Circuit Design, Automation, LSI, VLSI, Integrated Systems, Boards/Cards, I/O Boards/Cards
Published: 1984

3. The Materials and Components of Hybrid ICs

Subjects: Market, Japan, Hybrid Circuits, Integrated Circuits, Chip Packaging, Packaging Density, Increase, Integrated Circuit Fabrication
Published: 1984

4. New Examples Offered in the Smallness Race

Subjects: Miniaturization, Radio Equipment, Calculators, Microelectronics, Packaging Density, Japan, Walkman WM-20, Filmcard
Published: 1984

5. Hitachi, Showa Denko Develop Reactive Ion-Etching Method

Subjects: Integrated Circuit Fabrication, LSI, VLSI, Integrated Circuits, Technology, Performance Improvement, Packaging Density, Increase, Microelectronics, Miniaturization, Semiconductor Device, Production, Manufacturing, New Technique, Hitachi Ltd. -- Research, Showa Denka -- Research
Published: 1984

6. Reduction of Turn-Around Time and Chip Component Developments: Keywords for Thick-Film Hybrid ICs

Author: Sugaya, Y. and Hasegawa, T.
Subjects: Packaging Density, Integrated Circuit Fabrication, Circuit Design, Miniaturization, Low Cost, Hybrid Circuits, Chip Packaging, Turnaround Time, Thin-Film Circuits, Thick-Film Circuits
Published: 1983

7. Suwa Seikosha Expands Rapidly in Development of Gate Arrays

Author: Takahashi, H. and Gomi, T.
Subjects: Product Development, Packaging Density, Semicustom Integrated Circuits, Gate Arrays, Technology, LSI, Japan, Logic Circuitry, Circuit Design, Manufacturing, CMOS, Custom IC, Integrated Circuits, SLA 6000
Published: 1983

8. Square Chip Resistors Accelerate Use of High-Density Mounting

Author: Kambara, S.
Subjects: Diagrams, Graphs, Resistor, Circuit Components, Packaging Density, Packaging, Thin Films, Thin-Film Circuits, Integrated Circuits
Published: 1983

9. Increasing Compatibility for MELF Chip Resistors

Author: Honda, Y.
Subjects: Resistor, Compatibility, Integrated Circuits, Circuit Components, Production, Automation, Manufacturing, Packaging, Packaging Density
Published: 1983

10. Resistor Networks Put Flexibility Into More Compact Circuitry

Author: Sogabe, K.
Subjects: Resistor, Networks, Circuitry, Integrated Circuits, Manufacturing, Packaging Density, Packaging
Published: 1983

11. STM-3 Multi-Mounter Is Indispensable for High Density Packaging

Author: Kubo, M.
Subjects: Packaging Density, Packaging, Integrated Circuits, Manufacturing, Assembly Line, Circuit Components, Circuit Printing, Boards/Cards
Published: 1983

12. Resistor Networks; Low Profile and Automatic Insertion Are Realized

Author: Izumida, H.
Subjects: Resistor, Networks, Automation, Production, Thick-Film Circuits, Methods, Packaging Density, Packaging, Japan
Published: 1983

13. Automatic Assembly Equipment Conforming to High-Density Packaging

Subjects: Assembly Line, Packaging, Packaging Density, Soldering, Technology, Integrated Circuits, Manufacturing, Automation
Published: 1983

14. New Equipment and Methods for Bonding Semiconductor Elements

Author: Izumi, M. and Masuda, M.
Subjects: Semiconductor Device, Production, Laser, Technology, Optics, Semiconductor Industry, Manufacturing, Control Systems, Packaging Density, Product Development, Methods, Semiconductor Preparation
Published: 1983

15. Digital DIP Switches for Instrumentation

Author: Takeuchi, S.
Subjects: Trends, Switches, Circuit Components, Miniaturization, Performance Improvement, Products, Manufacturing, Technology, Size, Reduction, Packaging Density, Increase, Dual Inline Packages, Chip Packaging
Published: 1983

16. Packaging Packs More Power Into Mainframe Supercomputers

Author: Kawano, K.
Subjects: Supercomputer, Mainframe Computer, Packaging, Bundled Software, Computer Systems, Technology, Packaging Density, Increase, Performance Improvement, Processor Speed, Chip Packaging, FACOM M-380-382 Fujitsu Ltd, FACOM M-200 Fujitsu Ltd
Published: 1983

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