18 results on '"Wang, K. K."'
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2. Flow Analysis in a Chip Cavity During Semiconductor Encapsulation
3. Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation
4. A Method for Extracting and Thickening a Mid-Surface of a 3D Thin Object Represented in NURBS
5. Elastic Buckling of a Circular Disk due to Internal Membrane Forces
6. A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments
7. Integrated Simulation of Fluid Flow and Heat Transfer in Injection Molding for the Prediction of Shrinkage and Warpage
8. Numerical Simulation of the Coinjection Molding Process
9. CAE of Mold Cooling in Injection Molding Using a Three-Dimensional Numerical Simulation
10. A Computer-Aided Cooling-Line Design System for Injection Molds
11. Geometric Representation of Translational Swept Volumes and its Applications
12. Closure to “Discussion of ‘Investigation of Face-Milling Tool Temperatures by Simulation Techniques’” (1969, ASME J. Eng. Ind., 91, p. 779)
13. Investigation of Face-Milling Tool Temperatures by Simulation Techniques
14. Erratum: “An Analysis of Punching Variables by Two-Level Fractional Factorial Design” (Journal of Engineering for Industry, 1970, 92, pp. 435–443)
15. An Analysis of Punching Variables by Two-Level Fractional Factorial Design
16. Temperature Responses and Experimental Errors for Multitooth Milling Cutters
17. Closure to “Discussions of ‘An Analysis of Punching Variables by Two-Level Fractional Factorial Design’” (1970, ASME J. Eng. Ind., 92, p. 443)
18. Optimization of Inertia Welding Process by Response Surface Methodology
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