Author: "Rzepka, S." / Publisher: asme international - Searchworks@Jio Institute Digital Library Search Results

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Your search keyword '"Rzepka, S."' showing total 3 results

Start Over Author "Rzepka, S." Publisher asme international

3 results on '"Rzepka, S."'

1. Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Author: Döring, Ralf, primary, Dudek, R., additional, Rzepka, S., additional, Scheiter, L., additional, Noack, E., additional, and Seiler, B., additional
Published: 2022
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2. Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

Author: Otto, A., primary, Kaulfersch, E., additional, Singh, P., additional, Romano, C., additional, Hildebrandt, M., additional, and Rzepka, S., additional
Published: 2021
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3. The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints

Author: Rzepka, S., primary, Korhonen, M. A., additional, Meusel, E., additional, and Li, C.-Y., additional
Published: 1998
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