1. Thermophysical and Geometrical Effects on the Thermal Performance and Optimization of a Three-Dimensional Integrated Circuit
- Author
-
Shujuan Wang, Siavash Ebrahimi, Fatemeh Tavakkoli, and Kambiz Vafai
- Subjects
010302 applied physics ,Materials science ,Mechanical Engineering ,Thermal resistance ,Three-dimensional integrated circuit ,Thermodynamics ,Mechanical engineering ,02 engineering and technology ,Integrated circuit ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,Thermal conduction ,01 natural sciences ,law.invention ,Heat pipe ,Thermal conductivity ,Mechanics of Materials ,law ,0103 physical sciences ,Heat spreader ,Heat transfer ,General Materials Science ,0210 nano-technology - Abstract
A comprehensive analysis and optimization of a three-dimensional integrated circuit (3D IC) structure and its thermophysical attributes are presented in this work. The thermophysical and geometrical attributes studied in this paper include the die, device layer, heat sink, and heat spreader, which are critical structures within a 3D IC. The effect of the power density of the device layer which is the source of heat generation within the chip as well as the through silicon vias (TSV) and microbumps is also considered in our investigation. The thermophysical and geometrical parameters that have a significant impact on the thermal signature of the 3D IC as well as those that have an insignificant impact were established. The comprehensive analysis of different geometrical and thermophysical attributes can guide the design and optimization of a 3D IC structure and decrease the cost.
- Published
- 2016