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In the present study, thermal stability of α-Ga2O3 under vacuum and ambient pressure conditions was investigated in situ by x-ray diffraction and transmission electron microscopy (TEM). It was observed that the thermal stability of α-Ga2O3 increased by 200 °C when pressure was lowered from an atmospheric to a vacuum level. This finding can be explained by oxygen diffusion under different oxygen partial pressures. In addition, in situ TEM imaging revealed that, once past the decomposition temperature, the onset of phase change propagates from the top crystal surface and accumulates strain, eventually resulting in a fractural film. The mechanism of α-Ga2O3 to β-Ga2O3 transition is evaluated through experiments and is discussed in this manuscript.

There is increasing interest in α-polytype Ga2O3 for power device applications, but there are few published reports on dielectrics for this material. Finding a dielectric with large band offsets for both valence and conduction bands is especially challenging given its large bandgap of 5.1 eV. One option is HfSiO4 deposited by atomic layer deposition (ALD), which provides conformal, low damage deposition and has a bandgap of 7 eV. The valence band offset of the HfSiO4/Ga2O3 heterointerface was measured using x-ray photoelectron spectroscopy. The single-crystal α-Ga2O3 was grown by halide vapor phase epitaxy on sapphire substrates. The valence band offset was 0.82 ± 0.20 eV (staggered gap, type-II alignment) for ALD HfSiO4 on α-Ga0.2O3. The corresponding conduction band offset was −2.72 ± 0.45 eV, providing no barrier to electrons moving into Ga2O3.