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We have deposited Ti(C,N) thin films on Si(100) and D2 steel substrates in the temperature range of 200–300 °C using tetrakis diethylamidotitanium (TDEAT) and titanium isopropoxide (TIP) by pulsed dc plasma-enhanced metalorganic chemical vapor deposition (PEMOCVD). Radical formation and ionization behaviors in plasma are analyzed in situ by optical emission spectroscopy at various pulsed bias voltages and gas conditions. H2 and He+H2 gases are used as carrier gases to compare plasma parameters, and the effect of N2 and NH3 as reactive gas is also evaluated by the reduction of the C content of the films. Polycrystalline Ti(C,N) thin films were successfully grown on either D2 steel or Si(100) surfaces with TDEAT at temperatures as low as 200 °C. For TIP, however, only TiOCN thin films were obtained on Si(100) substrates. The best deposition process is evident for H2 and N2 gas atmospheres and bias voltage of 600 V. The higher film hardness is about 1760 Hk 0.01, but depends on gas species and bias voltage. ...

We have deposited thick SiC thin films on graphite substrates in the temperature range of 700–850 °C using single-molecular precursors by both thermal metal–organic chemical-vapor deposition (MOCVD) and plasma-enhanced MOCVD (PEMOCVD) methods for oxidation-protection wear and tribological coating. Hexamethyldisilane (HMDS), (CH3)3Si–Si(CH3)3, was used as a single-source precursor, and hydrogen and Ar were used as a bubbler and carrier gas. A highly oriented polyerystalline cubic SiC layer in the [111] direction was successfully deposited on graphite at temperatures as low as 800 °C with HMDS by PEMOCVD. For thermal MOCVD, on the other hand, only amorphous SiC layers were obtained at 850 °C. From this study, we confirmed that PEMOCVD was a highly effective process in improving the characteristics of the SiC layers compared to those grown by thermal MOCVD. The mechanical and oxidation-resistant properties have been assessed. The optimum SiC film was obtained at 850 °C and rf power of 200 W. The maximum depo...