1. Reduced trap state density in AlGaN/GaN HEMTs with low-temperature CVD-grown BN gate dielectric.
- Author
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He, Ziyi, Zhang, Xiang, Pieshkov, Tymofii S., Yekta, Ali Ebadi, Terlier, Tanguy, Mudiyanselage, Dinusha Herath, Wang, Dawei, Da, Bingcheng, Xu, Mingfei, Luo, Shisong, Chang, Cheng, Li, Tao, Nemanich, Robert J., Zhao, Yuji, Ajayan, Pulickel M., and Fu, Houqiang
- Subjects
ELECTRON energy loss spectroscopy ,DENSITY of states ,SECONDARY ion mass spectrometry ,MODULATION-doped field-effect transistors ,BORON nitride ,GALLIUM nitride ,DIELECTRICS ,X-ray photoelectron spectroscopy - Abstract
In this Letter, low-temperature (400 °C) chemical vapor deposition-grown boron nitride (BN) was investigated as the gate dielectric for AlGaN/GaN metal–insulator–semiconductor high electron mobility transistors (MISHEMTs) on a Si substrate. Comprehensive characterizations using x-ray photoelectron spectroscopy, reflection electron energy loss spectroscopy, atomic force microscope, high-resolution transmission electron microscopy, and time-of-flight secondary ion mass spectrometry were conducted to analyze the deposited BN dielectric. Compared with conventional Schottky-gate HEMTs, the MISHEMTs exhibited significantly enhanced performance with 3 orders of magnitude lower reverse gate leakage current, a lower off-state current of 1 × 10
−7 mA/mm, a higher on/off current ratio of 108 , and lower on-resistance of 5.40 Ω mm. The frequency-dependent conductance measurement was performed to analyze the BN/HEMT interface, unveiling a low interface trap state density (Dit ) on the order of 5 × 1011 –6 × 1011 cm−2 eV−1 . This work shows the effectiveness of low-temperature BN dielectrics and their potential for advancing GaN MISHEMTs toward high-performance power and RF electronics applications. [ABSTRACT FROM AUTHOR]- Published
- 2024
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