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The recently developed precession electron diffraction (PED) technique in scanning transmission electron microscopy has been used to elucidate the local strain distribution and crystalline misorientation in a CMOS fabricated strained Ge microdisk structure grown on a Si substrate. Tensile strained Ge and GeSn structures are considered to be potential CMOS compatible optical sources, as both Sn alloying and strain can lead to a direct band-structure and lasing. The ability to take nanometer resolution, experimental measurements of the cross-sectional strain distribution, is important to understand modal gain and, therefore, ultimate device performance. In this work, we demonstrate PED techniques to measure the cross-sectional strain field in tensile Ge microdisks strained by SiN stressors. The strain maps are interpreted and compared with a finite element model of the strain in the investigated structure, which shows good agreement, and, therefore, highlights the applicability of PED techniques for mapping strained photonic structures. The technique also allows for the observation of strain relaxation due to dislocation pileup, further demonstrating the benefit of such experimental techniques. [ABSTRACT FROM AUTHOR]

The design, fabrication, and characterization of a silicon nitride waveguide polarization rotator and polarization beam splitter that operate with a polarization extinction ratio (PER) of ∼30 dB at the rubidium atomic transition of 780 nm wavelength are demonstrated. These polarization devices are fabricated on the same chip using a self-aligned process for integration of the rib and ridge waveguide structures. The polarization rotator is based on the mode evolution approach using adiabatic tapers and demonstrates a PER of ≥20 dB over a 100 nm bandwidth (730–830 nm wavelengths) with an insertion loss (IL) ≤1 dB. The polarization beam splitter is based on a cascaded tapered asymmetric directional coupler with phase matching between the fundamental and higher order TM modes, whereas the TE mode is separated by the through port. This provides a PER ≥ 20 dB with IL ≤ 1 dB over a 50 nm bandwidth for the cross port and a PER ≥ 15 dB with an IL ≤ 1 dB over an 18 nm bandwidth for the through port. These polarization control waveguide devices will enable photonic integrated circuits for saturated absorption spectroscopy of atomic vapors for laser stabilization on-chip. [ABSTRACT FROM AUTHOR]

We report electroluminescence originating from L-valley transitions in n-type Ge/Si0.15Ge0.85 quantum cascade structures centered at 3.4 and 4.9 THz with a line broadening of Δ f / f ≈ 0.2. Three strain-compensated heterostructures, grown on a Si substrate by ultrahigh vacuum chemical vapor deposition, have been investigated. The design is based on a single quantum well active region employing a vertical optical transition, and the observed spectral features are well described by non-equilibrium Green's function calculations. The presence of two peaks highlights a suboptimal injection in the upper state of the radiative transition. Comparison of the electroluminescence spectra with a similar GaAs/AlGaAs structure yields one order of magnitude lower emission efficiency. [ABSTRACT FROM AUTHOR]

The design, modeling, micro-fabrication, and characterization of an ultra-broadband Ge-on-Si waveguide polarization rotator are presented. The polarization rotator is based on the mode evolution approach where adiabatic symmetric and anti-symmetric tapers are utilized to convert from the fundamental transverse magnetic to electric mode. The device is shown to be extremely fabrication tolerant and simple to fabricate. The fabricated devices demonstrate a polarization extinction ratio of ≥15 dB over a 2 μm bandwidth (9–11 μm wavelength) with an average insertion loss of <1 dB, which is an order of magnitude improvement compared to previously demonstrated devices. This device will provide polarization flexibility when integrating quantum cascade lasers on-chip for mid-infrared waveguide molecular spectroscopy. [ABSTRACT FROM AUTHOR]

Thermoelectric materials generate electricity from thermal energy using the Seebeck effect to generate a voltage and an electronic current from a temperature difference across the semiconductor. High thermoelectric efficiency ZT requires a semiconductor with high electronic conductivity and low thermal conductivity. Here, we investigate the effect of scattering from threading dislocations of edge character on the thermoelectric performance of individual n and p-channel SiGe multiple quantum well structures. Our detailed physical simulations indicate that while the thermal and electrical conductivities decrease with increasing dislocation scattering/density, the Seebeck coefficient actually increases with increasing threading dislocation density above 106 cm-2 at room temperature, due to an increase in the entropy associated with each carrier. The collective result of these individual effects, is that the present Si-based quantum well designs can tolerate scattering by a threading dislocation density up to ∼108 cm-2, well within the capabilities of modern growth techniques, before significant reductions in ZT due to scattering from threading dislocations is observed. [ABSTRACT FROM AUTHOR]

Thin metal films alone or incorporated in a multilayer stack structure with dielectric films are good candidates of terahertz absorbers necessary for achieving the maximum responsivity in microbolometer devices. However, the design and optimization of these absorber structures depend on the knowledge of the complex refractive index of metal films in the terahertz frequency range, which is not easy to measure or determine from experiment. This paper presents a novel method that allows fast and reliable extraction of the complex refractive index from terahertz time-domain spectroscopy. It starts with terahertz time-domain transmission measurements, followed by Fourier transforms to obtain the transmission spectrum in the frequency range of 0.1–3 THz, and finally an extraction process using the enhanced “on-the-downhill” algorithm. Some experimental examples are given, all of which show good agreement with theoretical calculations. This extraction method, combined with the scattering matrix model, can help design and optimize complicated absorber structures for terahertz microbolometers. [ABSTRACT FROM AUTHOR]

n-type Ge/SiGe terahertz quantum cascade lasers are investigated using non-equilibrium Green's functions calculations. We compare the temperature dependence of the terahertz gain properties with an equivalent GaAs/AlGaAs quantum cascade laser design. In the Ge/SiGe case, the gain is found to be much more robust to temperature increase, enabling operation up to room temperature. The better temperature robustness with respect to III–V is attributed to the much weaker interaction with optical phonons. The effect of lower interface quality is investigated and can be partly overcome by engineering smoother quantum confinement. [ABSTRACT FROM AUTHOR]

We address nonradiative recombination pathways by leveraging surface passivation and dislocation management in lm-scale arrays of Ge crystals grown on deeply patterned Si substrates. The time decay photoluminescence (PL) at cryogenic temperatures discloses carrier lifetimes approaching 45 ns in band-gap engineered Ge micro-crystals. This investigation provides compelling information about the competitive interplay between the radiative band-edge transitions and the trapping of carriers by dislocations and free surfaces. Furthermore, an in-depth analysis of the temperature dependence of the PL, combined with capacitance data and finite difference time domain modeling, demonstrates the effectiveness of GeO2 in passivating the surface of Ge and thus in enhancing the room temperature PL emission. [ABSTRACT FROM AUTHOR]

The development of nanofabrication techniques for creating high aspect ratio (~50:1) sub-10nm silicon nanowires (SiNWs) with smooth, uniform, and straight vertical sidewalls using an inductively coupled plasma (ICP) etching process at 20 °C is reported. In particular, to improve the quality and flexibility of the pattern transfer process for high aspect ratio SiNWs, hydrogen silsesquioxane, a high-resolution, inorganic, negative-tone resist for electron-beam lithography has been used as both the resist for defining sub-10nm patterns and the hard mask for etching the underneath silicon material. The effects of SF6/C4F8 gas flow rates, chamber pressure, platen power and ICP power on the etch rate, selectivity, and sidewall profile are investigated. To minimize plasma-induced sidewall damage, moderate plasma excitation power (ICP power of 600W) and low ion energy (platen power of 6-12W) were used. Using the optimized etch process at room temperature (20°C), the authors have successfully fabricated sub-10nm SiNWs, which have smooth vertical sidewall profile and aspect ratios up to ~50:1. This optimized etch combined with a controlled thermal oxidation allows the realization of consistent, reproducible, and reliable SiNW devices with nominal widths from 100nm down to sub-5nm in silicon on top of SiO2 fabricated on silicon on insulator substrates. [ABSTRACT FROM AUTHOR]