1. Wetting of Pb on Oxidized Micropatterned Si Wafers
- Author
-
Cécile Lesueur, Jean-Pierre Baland, and Dominique Chatain
- Subjects
Contact angle ,Triple line ,Materials science ,Electrochemistry ,Mineralogy ,General Materials Science ,Wafer ,Surfaces and Interfaces ,Wetting ,Composite material ,Condensed Matter Physics ,Spectroscopy - Abstract
The wetting of lead on silicon wafers with regularly patterned holes, and covered by native silica, has been investigated at 610 K under ultrahigh vacuum conditions. The advancing and receding macroscopic contact angles have been measured by slowly compressing and stretching a liquid lead bridge between two identically patterned substrates. These angles are shown to depend on the distribution of the holes in the wafers and the continuity of the triple line.
- Published
- 2006