1. Polyimide Composites with Fluorinated Graphene and Functionalized Boron Nitride Nanosheets for Heat Dissipation.
- Author
-
Zhang, Yang, Wang, Jing-Wen, Ma, Ying-Jie, Zhang, Zi-Long, and Tao, Liang
- Abstract
Polyimide (PI) with excellent comprehensive properties has been extensively applied in electronic devices. The miniaturization and integration of electrical equipment put forward more stringent requirements for heat dissipation, so a composite with high thermal conductivity and low dielectric properties has become a critical factor. In this work, fluorinated graphene (FG) and boron nitride nanosheets modified with polydopamine (PDA@BNNS) were filled into the PI matrix as fillers to prepare FG/PDA@BNNS/PI composites. The mixed filling of FG and BNNS synergistically improves the dielectric and thermal conductivity, and this research breaks the balance barrier between dielectric and thermal conductivity. The resulting 4.99 wt % FG/PDA@BNNS/PI composite exhibited excellent comprehensive properties, including ultralow dielectric constant of 1.67, low loss of 0.013 at 1 MHz, and high thermal conductivity of 2.464 W m
–1 K–1 . In addition, the film also showed standout breakdown resistance (81.22 kV/mm) and mechanical properties such that the tensile strength reached 35.7 MPa. This report can inspire future development of composites for electronic packaging. [ABSTRACT FROM AUTHOR]- Published
- 2024
- Full Text
- View/download PDF