1. Effectof Surfactant Concentration and Loading Ratioon the Electroless Plating Characteristics of Dense Pd Composite Membranes.
- Author
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Pujari, Murali, Agarwal, Amrita, Uppaluri, Ramgopal, and Verma, Anil
- Subjects
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SURFACE active agents , *ELECTROLESS plating , *PALLADIUM compounds , *COMPOSITE materials , *SONICATION , *REDUCING agents - Abstract
Thisarticle presents the effects of the concentration and loadingratios of a cationic surfactant (CTAB) on the performance characteristicsof sonication-induced electroless plating baths for the fabricationof dense palladium composite membranes. The plating experiments wereconducted with dropwise addition of reducing agent at loading ratiosof 203 and 407 cm2/L, a palladium solution concentrationof 0.005 M, and surfactant solution concentrations of 1–4 CMC.A plating bath consisting of 0.005 M Pd with a surfactant concentrationof 2 CMC at a loading ratio of 203 cm2/L provided a 100%dense palladium composite membrane after 8 h of sequential platingwith a Pd film thickness of 11.16 μm and a plating efficiencyof 96%. The identified process can provide dense Pd/PSS compositemembranes at a fabrication cost of 13.27 $/cm2, which is60% more cost-effective than the best-known SIEP process. [ABSTRACT FROM AUTHOR]
- Published
- 2014
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