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Low ionic conductivity, oxidation potential, and poor lithium stability limit the applications of solid polymer electrolyte (SPE) in advanced energy storage systems. Combining functional inorganic materials and flexible polymers is crucial for achieving high ionic conductivity and exceptional rate performance in all-solid-state batteries (ASSBs). Herein, uniform boron nitride nanosphere (BNSPH) with reactive surface defects was prepared through an improved chemical vapor deposition method with high-temperature ammonia immobilization treatment and was introduced to the poly-(ethylene oxide) (PEO)-based SPE. Homogeneously dispersed nanostructures reduce the polymer's crystallinity, facilitating the movement of polymer chain segments and significantly improving the composite electrolyte's ionic conductivity. The interaction between BNSPH and the PEO chain enhances the structural stability of the composite polymer electrolyte (CPE) under high voltage, and the oxygen vacancies on the BNSPH surface immobilize TFSI–, promoting the transfer of more dissociated Li+ through the PEO chain. In addition, the excellent thermal conductivity enhances the interface stability and effectively avoids the growth of lithium dendrites. The CPE-5% exhibits an ionic conductivity of 3.86 × 10–4 S cm–1 and high voltage stability at 60 °C. Therefore, the assembled Li|CPE-5%|Li cell exhibited stable plating/stripping for 2000 h with a small polarization voltage. Furthermore, Li/LFP batteries incorporating CPE-5% exhibit remarkable rate performance (87.8 mA h g–1 at 2.0 C) and outstanding cycle stability (157.4 mA h g–1 after 150 cycles at 0.5 C and 60 °C). Furthermore, the NCM622/Li assembled with CPE-5% could achieve an excellent lifespan. This study confirms the feasibility of this application and inspire the application of defect-rich BNSPH in SPEs. [ABSTRACT FROM AUTHOR]

Advanced heat dissipation materials are necessary for powerful and miniaturized electronics. Hexagonal boron nitride (h-BN) is an ideal material for thermal management due to its electrical insulation but thermal conductivity. However, its utilization is seriously restricted by the pulverulence, and multilayer and chemical inertness. Herein, highly functionalized BN nanosheets (BNNSs) are exfoliated by a boric acid-assisted chemo-mechanical method and show stable dispersion in various solvents. An ingenious chemical etch- and mechanical force-induced exfoliation and functionalization mechanism is proposed. Due to the existence of strong interfacial interaction between BNNSs and poly-(vinyl alcohol) (PVA), a series of composite films with excellent thermal stability, low dielectric constant (2–4), negligible dissipation factor (<0.2), good machinability, and flexible bending and folding performances are prepared. The BNNSs' filling content can reach ∼90 wt %, and the BNNSs/PVA films' maximum tensile strength and modulus can be as high as ∼85.5 MPa and ∼7.6 GPa, respectively. Importantly, their in-plane thermal conductivity increases monotonously with the elevated BNNS content and temperature. The maximum thermal conductivity can reach up to 27.3 and 39.3 W·m–1·K–1 at 25 and 100 °C, respectively. Noteworthily, the BNNSs/PVA films show rapid thermal diffusion and can be readily designed as efficient heat dissipation components for integrated and intelligent electronic devices. [ABSTRACT FROM AUTHOR]

The rising concern over the usage of electronic devices and the operating environment requires efficient thermal interface materials (TIMs) to take away the excess heat generated from hotspots. TIMs are crucial in dissipating undesired heat by transferring energy from the source to the heat sink. Silicone oil (SO)-based composites are the most used TIMs due to their strong bonding and oxidation resistance. However, thermal grease performance is unreliable due to aging effects, toxic chemicals, and a higher percentage of fillers. In this work, TIMs are prepared using exfoliated hexagonal boron nitride nanosheets (h-BNNS) as a nanofiller, and they were functionalized by ecofriendly natural biopolymer soy protein isolate (SPI). The exfoliated h-BNNS has an average lateral size of ∼266 nm. The functionalized h-BNNS/SPI are used as fillers in the SO matrix, and composites are prepared using solution mixing. Hydrogen bonding is present between the organic chain/oxygen in silicone polymer, and the functionalized h-BNNS are evident from the FTIR measurements. The thermal conductivity of h-BNNS/SPI/SO was measured using the modified transient plane source (MTPS) method. At room temperature, the maximum thermal conductivity is 1.162 Wm -1 K -1 (833% enhancement) at 50 wt % of 3:1 ratio of h-BNNS:SPI, and the thermal resistance (TR) of the composite is 5.249 × 10 6 K/W which is calculated using the Foygel nonlinear model. The heat management application was demonstrated by applying TIM on a 10 W LED bulb. It was found that during heating, the 50 wt % TIM decreases the surface temperature of LED by ∼6 °C compared with the pure SO-based TIM after 10 min of ON condition. During cooling, the modified TIM reduces the surface temperature by ∼8 °C under OFF conditions within 1 min. The results indicate that natural polymers can effectively stabilize and link layered materials, enhancing the efficiency of TIMs for cooling electronics and LEDs.

Laser lighting devices, comprising an ultraviolet (UV) laser chip and a phosphor material, have emerged as a highly efficient approach for generating high-brightness light sources. However, the high power density of laser excitation may exacerbate thermal quenching in conventional polycrystalline or amorphous phosphors, leading to luminous saturation and the eventual failure of the device. Here, for the first time, we raise a single-crystal (SCs) material for laser lighting considering the absence of grain boundaries that scatter electrons and phonons, achieving high thermal conductivity (0.81 W m -1 K -1 ) and heat-resistance (575 °C). The SCs products exhibit a high photoluminescence quantum yield (89%) as well as excellent stability toward high-power lasers (>12.41 kW/cm 2 ), superior to all previously reported amorphous or polycrystalline matrices. Finally, the laser lighting device was fabricated by assembling the SC with a UV laser chip (50 mW), and the device can maintain its performance even after continuous operation for 4 h. Double perovskite single crystals doped with Yb 3+ /Er 3+ demonstrated multimodal luminescence with the irradiation of 355 and 980 nm lasers, respectively. This characteristic holds significant promise for applications in spectrally tunable laser lighting and multimodal anticounterfeiting.

The scaling-down of chip size and the increase in on-chip power density require highly efficient thermal management materials in electronic packaging. The excellent thermal conductivity and unique two-dimensional structure of graphene make it an ideal candidate for heat spreader films to alleviate the hot spots on chips. Reduction of graphene oxide (GO) films has been utilized as an effective way to achieve the large-scale production of the thermally conductive graphene films. However, this approach usually requires high-temperature annealing at 1000–3000 °C in order to achieve the high conductivity needed, which dramatically increases the energy and time consumption and thus the total cost. In this contribution, graphene films free of high-temperature treatment with an in-plane thermal conductivity up to 1102.62 W·m–1·K–1 are obtained by simple chemical reduction of GO. The high conductivity is achieved by adjusting the concentration of GO solution and mixing GO sheets with different sizes to optimize the connectivity and compactness of GO films. While the majority of previous work relies on the graphitic structure restoration by high-temperature treatment, our work demonstrates that the geometric organization of graphene sheets also plays an important role in the thermal conductivity of graphene films. [ABSTRACT FROM AUTHOR]

Thermally conductive cellulose-based composites have great application potential in the thermal management of portable and wearable electronic devices. In this work, cellulose-based composites with excellent mechanical and thermal properties were developed by using lysozyme-modified graphene nanoplatelets (LmGNP), epichlorohydrin (ECH), and hydrolyzed cellulose via forming strong double-cross-linked interface interactions, including the hydrogen bond network generated between LmGNP and cellulose and the chemical cross-link of ECH. As for the composites containing 8 wt % LmGNP, the in-plane thermal conductivity was 3.341 W·m -1 K -1 , while the tensile stress was 114.60 MPa, which increased by 297.3 and 146.2%, respectively, compared to pure cellulose. Along with the good stability, insulation, and lightweight properties, the fabricated composites have the potential to become a promising heat dissipation material for wearable electronic devices.

Heat dissipation is an increasingly critical technological challenge in modern electronics and photonics as devices continue to shrink to the nanoscale. To address this challenge, high thermal conductivity materials that can efficiently dissipate heat from hot spots and improve device performance are urgently needed. Boron phosphide is a unique high thermal conductivity and refractory material with exceptional chemical inertness, hardness, and high thermal stability, which holds high promises for many practical applications. So far, however, challenges with boron phosphide synthesis and characterization have hampered the understanding of its fundamental properties and potential applications. Here, we describe a systematic thermal transport study based on a synergistic synthesis-experimental-modeling approach: we have chemically synthesized high-quality boron phosphide single crystals and measured their thermal conductivity as a record-high 460 W/mK at room temperature. Through nanoscale ballistic transport, we have, for the first time, mapped the phonon spectra of boron phosphide and experimentally measured its phonon mean free-path spectra with consideration of both natural and isotope-pure abundances. We have also measured the temperature- and size-dependent thermal conductivity and performed corresponding calculations by solving the three-dimensional and spectral-dependent phonon Boltzmann transport equation using the variance-reduced Monte Carlo method. The experimental results are in good agreement with that predicted by multiscale simulations and density functional theory, which together quantify the heat conduction through the phonon mode dependent scattering process. Our finding underscores the promise of boron phosphide as a high thermal conductivity material for a wide range of applications, including thermal management and energy regulation, and provides a detailed, microscopic-level understanding of the phonon spectra and thermal transport mechanisms of boron phosphide. The present study paves the way toward the establishment of a new framework, based on the phonon spectra–material structure relationship, for the rational design of high thermal conductivity materials and nano- to multiscale devices. [ABSTRACT FROM AUTHOR]

Adhesion and spreading of liquid metals (LMs) on substrates are essential steps for the generation of flexible electronics and thermal management devices. However, the controlled deposition is limited by the high surface tension and peculiar wetting and adhesion behavior of LMs. Herein, we introduce gelatin-regulated LM droplet deposition and sintering (GLMDDS), for the upscalable production of conformally adhesive, solidlike, yet transient LM thin films and patterns on diverse substrates. This method involves four steps: homogeneous deposition of LM microdroplets, gelation of the LM-gelatin solution, toughening of the gelatin hydrogel by solvent displacement, and peeling-induced sintering of LM microdroplets. The LM thin film exhibits a three-layer structure, comprising an LM microdroplet-embedded tough organohydrogel adhesion layer, a continuous LM layer, and an oxide skin. The composite exhibits high stretchability and mechanical robustness, conformal adhesion to various substrates, high conductivity (4.35 × 10 5 S·m -1 ), and transience (86% LM recycled). Large-scale deposition (i.e., 5.6 dm 2 ) and the potential for patterns on diverse substrates demonstrate its upscalability and broad suitability. Finally, the LM thin films and patterns are applied for flexible and wearable devices, i.e., pressure sensors, heaters, human motion tracking devices, and thermal management devices, illustrating the broad applicability of this strategy.

The epitaxy of III-nitrides on metallic substrates is competitive due to the advantages of vertical carrier injection, enhanced heat dissipation, and flexible application in various III-nitride-based devices. However, the serious lattice mismatch, atom diffusion, and interface reaction under the rigorous growth conditions have caused enormous obstacles. Based on the thermal and chemical stability of the graphene layer, we propose the van der Waals epitaxy of c-oriented wurtzite AlGaN on the polycrystalline Mo substrate by high-temperature metal-organic chemical vapor deposition. The insertion of a graphene layer interrupts the chaotic epitaxial relationship between the polycrystalline metal and epilayers, resulting in the single-crystalline orientation along the wurtzite (0002) plane and residual stress release in AlGaN because of the weak van der Waals interaction. We also demonstrate that the epitaxy of AlGaN on Mo metal possesses enhanced heat dissipation ability, in which the epilayer temperature is controlled at only 28.7 °C by the heating of a ∼54 °C hot plate. The heat dissipation enhancement for the present epitaxial structures provides a desirable strategy for the fabrication of efficient ultraviolet devices with excellent stability and lifetime.

Silicon (Si) is a promising high-capacity material for lithium-ion batteries; however, its limited reversibility hinders commercial adoption. Approaches such as particle and crystallite size reduction, introduction of conductive carbon, and use of different electrolyte solvents have been explored to overcome these electrochemical limitations. Herein, operando isothermal microcalorimetry (IMC) is used to probe the influence of silicon particle size, electrode composition, and electrolyte additives fluoroethylene carbonate and vinylene carbonate on the heat flow during silicon lithiation. The IMC data are complemented by X-ray photoelectron and Raman spectroscopies to elucidate differences in solid electrolyte interphase (SEI) composition. Nanosized (∼50 nm, n-Si) and micrometer-sized (∼4 μm, μ-Si) silicon electrodes are formulated with and without amorphous carbon and electrochemically lithiated in ethylene carbonate (EC), fluoroethylene carbonate (FEC), or vinylene carbonate (VC) based electrolytes. Notably, n-Si electrodes generate 53-61% more normalized heat relative to their μ-Si counterparts, consistent with increased surface area and electrode/electrolyte reactivity. Introduction of amorphous carbon significantly alters the heat flow profile where multiple exothermic peaks and increased normalized heat dissipation are observed for all electrolyte types. Notably, the VC-containing electrolyte demonstrates the greatest normalized heat dissipation of the electrode compositions tested showing as much as a 50% increase compared to the EC or FEC counterparts. The results are relevant to the understanding of silicon negative electrode function in the presence of electrolyte additives and provide insight relative to silicon containing cell reactivity and safety.

Personal cooling textiles are a promising energy-free pathway for confronting serious heat-related public health threats and improving industrial worker productivity. Current cooling strategies mainly focus on passive daytime radiation, and there is a lack of research on all-day cooling methods which utilize synergistic radiative, conductive, and evaporative heat dissipation. Herein, we demonstrate a hierarchical polyurethane/silicon nitride fibrous membrane with Janus wettability fabricated via a scalable electrospinning method followed by single-side hydrophilic plasma treatment. High angular-dependent solar reflectance (91%) and human body infrared emittance (93%) allow for a temperature drop of ∼21.9 °C under direct sunlight and ∼2.8 °C at night compared with traditional cotton. The innovative integration of Janus wettability and heat conduction in hierarchically designed textiles ensures a minimum sweat consumption of 0.5 mL h -1 , avoiding harmfully excessive perspiration. The excellent all-day cooling performance of this hierarchical textile presents great advantages for smart textile, energy-saving, and personal cooling applications.

Laser-driven illumination has unique advantages in high-power applications. Taking advantage of the valuable experience of light-emitting diodes (LED) development, phosphor in silicone (PiS) is considered to be one of the most potential commercial phosphor converter solutions for laser-driven illumination. However, the thermal quenching of the PiS converter is a bottleneck problem. Herein, a boron nitride (BN)-coated copper foam strategy is introduced for the laser-driven illumination system. The phosphor/silicone is embedded in the designed BN/copper foam to form a phosphor in metal (PiM) converter. Copper foam serves as an internal connected heat transfer channel; the BN coating solves the light absorption problem of the copper foam effectively. Based on this PiM(BN/copper foam) design, the heat dissipation is effectively improved. Under high-power laser excitation (8.13 W), the PiS converter cannot reach thermal equilibrium, and therefore the temperature increases sharply up to 660 °C. In comparison, the thermal performance of an optimized PiM(BN/copper foam) converter is able to maintain excellent stability, where the maximum temperature is only 166.5 °C. The proposed PiM strategy has a maximum temperature that is 493.5 °C lower than that of the reference PiS solution. Due to the superior thermal management, the luminous efficiency of the illumination system is constantly stable at 254 lm/W, though with less phosphor mass; and the related color temperature is about 6000 K all the time. This provides a practical and feasible heat-dissipation solution for high-power laser-driven illumination.

Carbon-based aerogels have drawn substantial attention for a wide scope of applications. However, the high intrinsic electrical conductivity limits their potential thermal management application in electronic packaging materials. Herein, a highly compressible, thermally conductive, yet electrically insulating fluorinated graphene aerogel (FGA) is developed through a hydrofluoric acid-assisted hydrothermal process. The macroscopic-assembled FGA constituting of tailored interconnected graphene networks with tunable fluorine coverage shows excellent elasticity and fatigue resistance for compression, despite a low density of 10.6 mg cm -3 . Moreover, the aerogel is proved to be highly insulating, with the observed lowest electrical conductivity reaching 4 × 10 -7 S cm -1 . Meanwhile, the aerogel exhibits prominent heat dissipation performance in a typical cooling procedure, which can be used to fabricate thermoconductive polymer composites for electronic packaging.

CuInSe 2 nanocrystals offer promise for optoelectronics including thin-film photovoltaics and printed electronics. Additive manufacturing methods such as photonic curing controllably sinter particles into quasi-continuous films and offer improved device performance. To gain understanding of nanocrystal response under such processing conditions, we investigate impacts of photoexcitation on colloidal nanocrystal lattices via time-resolved X-ray diffraction. We probe three sizes of particles and two capping ligands (oleylamine and inorganic S 2- ) to evaluate resultant crystal lattice temperature, phase stability, and thermal dissipation. Elevated fluences produce heating and loss of crystallinity, the onset of which exhibits particle size dependence. We find size-dependent recrystallization and cooling lifetimes ranging from 90 to 200 ps with additional slower cooling on the nanosecond time scale. Sulfide-capped nanocrystals show faster recrystallization and cooling compared to oleylamine-capped nanocrystals. Using these lifetimes, we find interfacial thermal conductivities from 3 to 28 MW/(m 2 K), demonstrating that ligand identity strongly influences thermal dissipation.

Architected Cu/reduced graphene oxide (rGO) heterostructures are achieved by electrodepositing copper on filament-printed rGO scaffolds. The Cu coating perfectly contours the printed rGO structure, but isolated Cu particles also permeate inside the filaments. Although the Cu deposition conveys a certain mass augment, the three-dimensional (3D) structures remain reasonably light (bulk density ≅ 0.42 g·cm -3 ). The electrical conductivity (σ e ) of the Cu/rGO structure (∼8 × 10 4 S·m -1 ) shows a notable increment compared to σ e of the rGO structure (∼2 × 10 2 S·m -1 ). The effect on the scaffold robustness is also notable with an increase of the compressive strength by nearly 10 times (from 20 kPa of the rGO scaffold to 150 kPa of the Cu/rGO structure) and cyclability as well. The improved thermal conductivity of the Cu-coated scaffolds (∼4 times higher), in addition to the σ e and strength improvements, suggests that 3D Cu/rGO structures could be suitable assemblies for integration into thermal dissipation systems, particularly as thermal interface materials, for compact electronic devices.

Thermal engineering dramatically impacts the efficiency of microelectronics, but the corresponding technology lags far behind the need. For energy-efficient thermal management, a Cu-Cu 2 O film with highly ordered core-shell nanowire arrays and a good self-protection property was successfully fabricated using the magnetron sputtering method. The dense arrangement of nanowires in the films enhances the electronic transport property (220 mΩ sq -1 ), while the modified stable Cu 2 O layer maintained its perfect heat dissipation property, along with long-term thermal stability. The core-shell and nanogaps structure imparted an anisotropic thermal conductivity, where the out-plane electronic thermal conductivity (321 ± 16 W m -1 K -1 ) was 33.6 times higher than the in-plane value. To study the role of anisotropic properties in heat dissipation, a boiling experiment and thermal simulation were undertaken. The Cu-Cu 2 O core-shell electrode was beneficial to elevate the heat transfer coefficient, which would cause a fast directional transport and reduction of interfacial superheating. We demonstrated that an advancement of microelectronics could be achieved by integrating Cu electrodes with an ordered architecture.

Group III-nitride light-emitting diodes (LEDs) fabricated on sapphire substrates typically suffer from insufficient heat dissipation, largely due to the low thermal conductivities (TCs) of their epitaxial layers and substrates. In the current work, we significantly improved the heat-dissipation characteristics of an InGaN/GaN quantum-well (QW) green LED by using hexagonal boron nitride (hBN) as a heat-transfer medium. Multiple-layer hBN with an average thickness of 11 nm was attached to the back of an InGaN/GaN-QW LED (hBN-LED). As a reference, an LED without the hBN (Ref-LED) was also prepared. After injecting current, heat-transfer characteristics inside each LED were analyzed by measuring temperature distribution throughout the LED as a function of time. For both LED chips, the maximum temperature was measured on the edge n-type electrode brightly shining fabricated on an n-type GaN cladding layer and the minimum temperature was measured at the relatively dark-contrast top surface between the p-type electrodes. The hBN-LED took 6 s to reach its maximum temperature (136.1 °C), whereas the Ref-LED took considerably longer, specifically 11 s. After being switched off, the hBN-LED took 35 s to cool down to 37.5 °C and the Ref-LED took much longer, specifically 265 s. These results confirmed the considerable contribution of the attached hBN to the transfer and dissipation of heat in the LED. The spatial heat-transfer and distribution characteristics along the vertical direction of each LED were theoretically analyzed by carrying out simulations based on the TCs, thicknesses, and thermal resistances of the materials used in the chips. The results of these simulations agreed well with the experimental results.

The facile fabrication of thin flexible electromagnetic interference (EMI) shielding materials with fast heat dissipation for adaptable tuning in both civil and military applications is in urgent demand. In our work, the flexible poly(vinylidene fluoride) (PVDF)/carbon nanotube (CNT) composite films decorated with anisotropy-shaped Co in flowers or chains were prepared and studied. The results showed that by increasing the Co filler contents, the EC (electrical conductivity), TC (thermal conductivity), and EMI shielding properties of such PVDF/CNT/Co (flowers or chains) flexible films were significantly improved. In contrast, the PVDF/CNT/Co-chain flexible films exhibit higher performance with respect to the EC, TC, and EMI shielding properties. Total shielding of 35.3 and 32.2 dB were, respectively, obtained by the PVDF/CNT/6 wt % Co-chain with an EC of 2.28 S/cm and the PVDF/CNT/6 wt % Co-flower with an EC of 1.94 S/cm at a film thickness of 0.3 mm. Possibly owing to the conductive dissipation, interfacial polarization, magnetic loss, multiple reflections, and scattering of EM waves, such flexible composite films possessed a remarkable absorption-dominated EMI shielding behavior. These new composite films with enhanced TC are easily able to transform microwave energy into Joule heating systems, making themselves greatly potential for effective EMI shielding as well as rapid heat dissipation.

Herein, we report high electromagnetic interference (EMI) shielding effectiveness of -40 dB in the K u -band (for a 600 μm thick film) through a unique core-shell heterostructure consisting of a ferritic core (Fe 3 O 4 ) and a conducting shell (multiwalled carbon nanotubes, MWCNTs) supported onto a dielectric spacer (here SiO 2 ). In recent times, materials with good flexibility, heat dissipation ability, and sustainability together with efficient EMI shielding at minimal thickness are highly desirable, especially if they can be easily processed into thin films. The resulting composites here shielded EM radiation mostly through absorption driven by multiple interfaces provided by the heterostructure. The shielding value obtained here is fairly superior among the different polymer nanocomposite-based EMI shielding materials. In addition to EMI shielding capability, this composite material exhibits outstanding heat dissipation ability (72 °C to room temperature in less than 90 s) as well as high heat sustainability. The composite material retained its EMI shielding property even after repeated heat cycles, thereby opening new avenues in the design of lightweight, flexible, and sustainable EMI shielding materials.

Heat dissipation is an increasingly critical technological challenge in modern electronics and photonics as devices continue to shrink to the nanoscale. To address this challenge, high thermal conductivity materials that can efficiently dissipate heat from hot spots and improve device performance are urgently needed. Boron phosphide is a unique high thermal conductivity and refractory material with exceptional chemical inertness, hardness, and high thermal stability, which holds high promises for many practical applications. So far, however, challenges with boron phosphide synthesis and characterization have hampered the understanding of its fundamental properties and potential applications. Here, we describe a systematic thermal transport study based on a synergistic synthesis-experimental-modeling approach: we have chemically synthesized high-quality boron phosphide single crystals and measured their thermal conductivity as a record-high 460 W/mK at room temperature. Through nanoscale ballistic transport, we have, for the first time, mapped the phonon spectra of boron phosphide and experimentally measured its phonon mean free-path spectra with consideration of both natural and isotope-pure abundances. We have also measured the temperature- and size-dependent thermal conductivity and performed corresponding calculations by solving the three-dimensional and spectral-dependent phonon Boltzmann transport equation using the variance-reduced Monte Carlo method. The experimental results are in good agreement with that predicted by multiscale simulations and density functional theory, which together quantify the heat conduction through the phonon mode dependent scattering process. Our finding underscores the promise of boron phosphide as a high thermal conductivity material for a wide range of applications, including thermal management and energy regulation, and provides a detailed, microscopic-level understanding of the phonon spectra and thermal transport mechanisms of boron phosphide. The present study paves the way toward the establishment of a new framework, based on the phonon spectra-material structure relationship, for the rational design of high thermal conductivity materials and nano- to multiscale devices.

In this study, a new and efficient dielectric-metal-dielectric-based thin-film encapsulation (DMD-TFE) with an inserted Ag thin film is proposed to guarantee the reliability of flexible displays by improving the barrier properties, mechanical flexibility, and heat dissipation, which are considered to be essential requirements for organic light-emitting diode (OLED) encapsulation. The DMD-TFE, which is composed of Al 2 O 3 , Ag, and a silica nanoparticle-embedded sol-gel hybrid nanocomposite, shows a water vapor transmission rate of 8.70 × 10 -6 g/m 2 /day and good mechanical reliability at a bending radius of 30 mm, corresponding to 0.41% strain for 1000 bending cycles. The electrical performance of a thin-film encapsulated phosphorescent organic light-emitting diode (PHOLED) was identical to that of a glass-lid encapsulated PHOLED. The operational lifetimes of the thin-film encapsulated and glass-lid encapsulated PHOLEDs are 832 and 754 h, respectively. After 80 days, the thin-film encapsulated PHOLED did not show performance degradation or dark spots on the cell image in a shelf-lifetime test. Finally, the difference in lifetime of the OLED devices in relation to the presence and thickness of a Ag film was analyzed by applying various TFE structures to fluorescent organic light-emitting diodes (FOLEDs) that could generate high amounts of heat. To demonstrate the difference in heat dissipation effect among the TFE structures, the saturated temperatures of the encapsulated FOLEDs were measured from the back side surface of the glass substrate, and were found to be 67.78, 65.12, 60.44, and 39.67 °C after all encapsulated FOLEDs were operated at an initial luminance of 10 000 cd/m 2 for sufficient heat generation. Furthermore, the operational lifetime tests of the encapsulated FOLED devices showed results that were consistent with the measurements of real-time temperature profiles taken with an infrared camera. A multifunctional hybrid thin-film encapsulation based on a dielectric-metal-dielectric structure was thus effectively designed considering the transmittance, gas-permeation barrier properties, flexibility, and heat dissipation effect by exploiting the advantages of each separate layer.

Owing to the outstanding properties of thermal conduction, lightweight, and chemical durability, carbon nanotubes (CNTs) have revealed promising applications in thermal management materials. Meanwhile, the increasingly popular portable electronics and the rapid development of space technology need lighter weight, smaller size, and more effective thermal management devices. Here, a novel kind of heat dissipation devices based on the superaligned CNT films and underlying microchannels is proposed, and the heat dissipation properties are measured at the natural condition. Distinctive from previous studies, by combining the advantages of microchannels and CNTs, such a novel heat dissipation device enables superior natural convection heat transfer properties. Our findings prove that the novel CNT-based devices could show an 86.6% larger total natural heat dissipation properties than bare copper plate. Further calculations of the radiation and natural convection heat transfer properties demonstrate that the excellent passive cooling properties of these CNT-based devices are primarily caused by the reinforcement of the natural convection heat transfer properties. Furthermore, the heat dissipation mechanisms are briefly discussed, and we propose that the very high heat transfer coefficients and the porous structures of superaligned CNT films play critical roles in reinforcing the natural convection. The novel CNT-based heat dissipation devices also have advantages of energy-saving, free-noise, and without additional accessories. So we believe that the CNT-based heat dissipation devices would replace the traditional metal-finned heat dissipation devices and have promising applications in electronic devices, such as photovoltaic devices, portable electronic devices, and electronic displays.

We have developed a hybrid phosphor-in-glass plate (PGP) for application in a remote phosphor configuration of high-power white light emitting diodes (WLEDs), in which single-layer graphene was used to modulate the thermal characteristics of the PGP. The degradation of luminescence in the PGP following an increase in temperature could be prevented by applying single-layer graphene. First, it was observed that the emission intensity of the PGP was enhanced by about 20% with graphene wrapping. Notably, the surface temperature of the graphene-wrapped PGP (G-PGP) was found to be higher than that of the bare PGP, implying that the graphene layer effectively acted as a heat dissipation medium on the PGP surface to reduce the thermal quenching of the constituent phosphors. Moreover, these experimental observations were clearly verified through a two-dimensional cellular automata simulation technique and the underlying mechanisms were analyzed. As a result, the proposed G-PGP was found to be efficient in maintaining the luminescence properties of the WLED, and is a promising development in high power WLED applications. This research could be further extended to generate a new class of optical or optoelectronic materials with possible uses in a variety of applications.

Thermal management has become a critical aspect in next-generation miniaturized electronic devices. Efficient heat dissipation reduces their operating temperatures and insures optimal performance, service life, and efficacy. Shielding against shocks, vibrations, and moisture is also imperative when the electronic circuits are located outdoors. Potting (or encapsulating) them in polymer-based composites with enhanced thermal conductivity (TC) may provide a solution for both thermal management and shielding challenges. In the current study, graphene is employed as a filler to fabricate composites with isotropic ultrahigh TC (>12 W m(-1) K(-1)) and good mechanical properties (>30 MPa flexural and compressive strength). To avoid short-circuiting the electronic assemblies, a dispersion of secondary ceramic-based filler reduces the electrical conductivity and synergistically enhances the TC of composites. When utilized as potting materials, these novel hybrid composites effectively dissipate the heat from electronic devices; their operating temperatures decrease from 110 to 37 °C, and their effective thermal resistances are drastically reduced, by up to 90%. The simple filler dispersion method and the precise manipulation of the composite transport properties via hybrid filling offer a universal approach to the large-scale production of novel materials for thermal management and other applications.

In the quest of YBa2Cu3O(7-δ) (Y123) bulk superconductors providing strong magnetic fields without failure, it is of paramount importance to achieve high thermal stabilities to safeguard the magnetic energy inside them during the trapping-field process, and sufficient mechanical reliability to withstand the stresses derived from the Lorenz force. Herein, we experimentally demonstrate a temperature rise induced by dissipative flux motion inside an Y123 thin-wall superconductor, and a significant thermal exchange in a composite bulk Y123 cryomagnet realized by embedding this superconductor with high thermal-conductivity metal network. It resulted in stimulating the maximum trapped field Bm, which reached 6.46 T on 15.9 mm-diameter single disk superconductor after magnetization by field cooling to 17 K under 7 T, leading to an improvement of 18% compared to the thin-wall superconductor. The composite cryomagnet particularly revealed the potential to trap stronger fields if larger magnetic activation is available. By virtue of the pore-free and crack-free microstructure of this cryomagnet, its strength σR was estimated to be 363 MPa, the largest one obtained so far for Y123 bulk superconductors, thus suggesting a striking mechanical reliability that seems to be sufficient to sustain stresses derived from trapped fields stronger than any values hitherto reported.