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Steady-state photocapacitance (SSPC) was conducted on nonpolar m-plane GaN n-type Schottky diodes to evaluate the defects induced by inductively coupled plasma (ICP) dry etching in etched-and-regrown unipolar structures. An ∼10× increase in the near-midgap Ec – 1.9 eV level compared to an as-grown material was observed. Defect levels associated with regrowth without an etch were also investigated. The defects in the regrown structure (without an etch) are highly spatially localized to the regrowth interface. Subsequently, by depth profiling an etched-and-regrown sample, we show that the intensities of the defect-related SSPC features associated with dry etching depend strongly on the depth away from the regrowth interface, which is also reported previously [Nedy et al., Semicond. Sci. Technol. 30, 085019 (2015); Fang et al., Jpn. J. Appl. Phys. 42, 4207–4212 (2003); and Cao et al., IEEE Trans. Electron Devices 47, 1320–1324 (2000)]. A photoelectrochemical etching (PEC) method and a wet AZ400K treatment are also introduced to reduce the etch-induced deep levels. A significant reduction in the density of deep levels is observed in the sample that was treated with PEC etching after dry etching and prior to regrowth. An ∼2× reduction in the density of Ec – 1.9 eV level compared to a reference etched-and-regrown structure was observed upon the application of PEC etching treatment prior to the regrowth. The PEC etching method is promising for reducing defects in selective-area doping for vertical power switching structures with complex geometries [Meyers et al., J. Electron. Mater. 49, 3481–3489 (2020)].

We extract the injection efficiency as a function of current density in single-quantum-well semipolar ( 20 2 ¯ 1 ¯) InGaN/GaN light-emitting diodes (LEDs) using small-signal RF measurements and rate equation analysis of the dominant carrier mechanisms. The rate equations are used to derive a small-signal equivalent circuit that yields expressions for the modulation response and the input impedance of the LED. Simultaneous fitting of the modulation response and the input impedance of the circuit to the measured modulation response and the input impedance of the LED gives the differential carrier lifetime, the net differential carrier escape time from the active region, and the differential recombination lifetime in the cladding layers. The extracted lifetimes are used to calculate the injection efficiency of the LED at various current densities. Carrier leakage from the active region results in an injection efficiency below one at low current densities. At high current densities, the injection efficiency approaches one due to the higher recombination rate in the quantum well (QW) and the lower carrier leakage. Analysis of the lifetimes shows that the higher recombination rate in the QW results in a slower increase in the carrier population in the QW compared to that in the cladding layers. However, the recombination current in the QW is generally higher than that in the cladding, leading to high injection efficiency at high current densities. The data are consistent with a Coulomb-enhanced capture process. The high injection efficiency obtained at high current densities rules out injection-related mechanisms as the primary cause of efficiency droop in semipolar ( 20 2 ¯ 1 ¯) InGaN/GaN LEDs.

InGaN/GaN light-emitting diodes (LEDs) with large modulation bandwidths are desirable for visible-light communication. Along with modulation speed, the consideration of the internal quantum efficiency (IQE) under operating conditions is also important. Here, we report the modulation characteristics of semipolar (202¯1¯) InGaN/GaN (LEDs) with single-quantum well (SQW) and multiple-quantum-well (MQW) active regions grown on free-standing semipolar GaN substrates with peak internal quantum efficiencies (IQEs) of 0.93 and 0.73, respectively. The MQW LEDs exhibit on average about 40–80% higher modulation bandwidth, reaching 1.5 GHz at 13 kA/cm2, but about 27% lower peak IQE than the SQW LEDs. We extract the differential carrier lifetimes (DLTs), RC parasitics, and carrier escape lifetimes and discuss their role in the bandwidth and IQE characteristics. A coulomb-enhanced capture process is shown to rapidly reduce the DLT of the MQW LED at high current densities. Auger recombination is also shown to play little role in increasing the speed of the LEDs. Finally, we investigate the trade-offs between the bandwidth and efficiency and introduce the bandwidth-IQE product as a potential figure of merit for optimizing speed and efficiency in InGaN/GaN LEDs.

High-speed InGaN/GaN blue light-emitting diodes (LEDs) are needed for future gigabit-per-second visible-light communication systems. Large LED modulation bandwidths are typically achieved at high current densities, with reports close to 1 GHz bandwidth at current densities ranging from 5 to 10 kA/cm2. However, the internal quantum efficiency (IQE) of InGaN/GaN LEDs is quite low at high current densities due to the well-known efficiency droop phenomenon. Here, we show experimentally that nonpolar and semipolar orientations of GaN enable higher modulation bandwidths at low current densities where the IQE is expected to be higher and power dissipation is lower. We experimentally compare the modulation bandwidth vs. current density for LEDs on nonpolar (101¯0), semipolar (202¯1¯), and polar 0001 orientations. In agreement with wavefunction overlap considerations, the experimental results indicate a higher modulation bandwidth for the nonpolar and semipolar LEDs, especially at relatively low current densities....

This work describes a small-signal microwave method for determining the differential carrier lifetime and transport effects in electrically injected InGaN/GaN light-emitting diodes (LEDs). By considering the carrier diffusion, capture, thermionic escape, and recombination, the rate equations are used to derive an equivalent small-signal electrical circuit for the LEDs, from which expressions for the input impedance and modulation response are obtained. The expressions are simultaneously fit to the experimental data for the input impedance and modulation response for nonpolar InGaN/GaN micro-LEDs on free-standing GaN substrates. The fittings are used to extract the transport related circuit parameters and differential carrier lifetimes. The dependence of the parameters on the device diameter and current density is reported. We also derive approximations for the modulation response under low and high injection levels and show that the transport of carriers affects the modulation response of the device, espe...