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As electronic devices continue to shrink in size while increasing in power, the generation of significant waste heat has become a major obstacle to further progress. Effective thermal management is crucial for the ongoing development of electronic devices. One promising approach to tackle this challenge is by manipulating the orientation of materials to enhance their anisotropic thermal conductivity, thereby enabling efficient heat dissipation in electronic devices. This paper aims to provide a comprehensive review of various strategies used to prepare oriented materials and their applications in the field of electronic device thermal management. Additionally, the challenges associated with these processes are summarized, offering insights into the current limitations and potential areas for improvement. [ABSTRACT FROM AUTHOR]