8 results on '"Lin, Pengrong"'
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2. Study on the 12 in. wafer uniformity of high aspect ratio TSV filling by using rotation cathode
3. Mechanical properties and microstructure evolution of Sn–Bi-based solder joints by microalloying regulation mechanism
4. Improved shear property of Sn-3.0Ag-0.5Cu/Ni micro solder joints under thermal shock between 77 K and 423 K by adding TiO2 nanoparticles
5. Study on no IMC Solid state bonding method for high-density 2.5D/3D integration.
6. Improvement of PbSn Solder Reliability with Ge Microalloying-Induced Optimization of Intermetallic Compounds Growth
7. Transient liquid phase bonding of Sn-Pb solder with added Cu particles
8. U2D2PCB: Uncertainty-Aware Unsupervised Defect Detection on PCB Images Using Reconstructive and Discriminative Models
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